Micro-electronics Technician

Anduril • Hudson, NH

7d • Onsite

About The Position

Advanced Infrared Solutions (AIRS), formerly American Infrared Solutions, was acquired by Anduril Industries in 2025 and operates as part of the Imaging Business Line. AIRS designs and builds cooled infrared cameras and subsystems, including Integrated Dewar Cooler Assemblies (IDCAs). From its Hudson, New Hampshire site, AIRS supplies these components to Anduril’s Imaging products and external customers in the defense, space, and commercial industrial sectors.

The Micro-electronics Technician performs precision wire bonding and microelectronic assembly. The role uses manual, semi-automatic, and automated bonding equipment to bond different wire types onto a range of substrates and components. It also involves interpreting detailed production and engineering documentation, setting up and optimizing equipment, inspecting assemblies, troubleshooting production issues, and following cleanroom, safety, and ESD procedures.

Requirements

• High school diploma or equivalent.
• Hands-on experience in wire bonding or microelectronic manufacturing, or equivalent practical skills gained through a related technical bootcamp or certification program.
• Proficiency in manual gold ball, wedge, and ribbon wire bonding, as well as semi-automatic and automated wire bonding.
• Experience with intricate microelectronic assembly, including precise adhesive and epoxy application.
• Exceptional manual dexterity and ability to work consistently and accurately under a microscope for an entire shift.
• Ability to read, interpret, and follow detailed build sheets, ICDs, and engineering drawings.
• Commitment to maintaining a clean, safe, and ESD-compliant work environment.
• Must be a U.S. Person due to required access to U.S. export-controlled information or facilities.

Responsibilities

• Operate and maintain manual, semi-automatic, and automated wire bonding equipment, including Westbond bonders.
• Perform gold ball, wedge, ribbon, alloy, and manganin wire bonding onto substrates and components such as duroid, ceramic, capacitors, resistors, diodes, and spirals.
• Assemble microelectronic components, including carefully mixing and applying adhesives, glues, and epoxies and integrating temperature diodes, capacitors, and alumina materials.
• Read and interpret build sheets, Interface Control Documents (ICDs), and engineering drawings, and follow their specifications and process requirements.
• Set up and calibrate wire bonding machinery and make minor adjustments, including optimizing loop-height parameters.
• Conduct in-process and final inspections using measurement equipment to verify bond quality and compliance with specifications and quality standards.
• Collaborate with technicians, engineers, and other technical personnel to identify and resolve production problems and contribute to process and parameter improvements.
• Meet quality, consistency, and work-rate standards while following cleanroom protocols, safety guidelines, and ESD procedures.

Benefits

• Highly competitive equity grants are included in the majority of full-time offers.
• Comprehensive, competitive benefits package available at little to no cost to employees.

What This Job Offers

• Job Type: Full-time
• Education Level: High school or GED