Metals Deposition Engineer

KBR•Beavercreek, OH

3d•Onsite

About The Position

KBR is seeking a hands-on, entry-level Metals Deposition Engineer to support mission-critical research initiatives within the Air Force Research Laboratory (AFRL) cleanroom. This role is a growth opportunity for a recent graduate who will train toward becoming the facility’s thin-film deposition subject matter expert. The engineer will operate and maintain high-vacuum deposition systems, including e-beam evaporation and magnetron sputtering, optimize process recipes, use analytical metrology tools such as SEM and profilometry, and support secondary cleanroom processes including photolithography and wafer dicing. The position also supports cleanroom operations and equipment maintenance, inventory tracking, and hazardous-waste inspections. The role is on-site at Wright-Patterson Air Force Base in Ohio, with minimal travel (0–20%) and standard working hours. The candidate must be able to obtain and maintain a U.S. Government Secret Security Clearance.

Requirements

Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related field.
0–2 years of experience.
Ability to obtain and maintain a U.S. Government Secret Security Clearance.
Strong mechanical aptitude.

Nice To Haves

Hands-on experience in cleanroom and laboratory environments.
Proficiency in Microsoft Office, including Excel, Word, and PowerPoint.
Effective organizational, interpersonal, and communication skills.

Responsibilities

Maintain, troubleshoot, modify, and repair equipment used to develop semiconductor materials, devices, and integrated circuits.
Operate and maintain metal vapor deposition systems.
Train to serve as the subject matter expert for the metals deposition systems.
Support operation and maintenance of the cleanroom facility.
Optimize process recipes.
Manage inventory tracking and inspections of environmental hazardous waste.
Use analytical metrology tools such as SEM and profilometry, and support processes such as photolithography and wafer dicing.