Mechanical Engineer

Qualcomm • San Diego, CA

6d

About The Position

Qualcomm Technologies Inc. is focused on inventing technologies that connect and empower people in ways that are elegant and accessible to all. QTI is actively seeking mechanical engineering candidates to join the QCT Product & Test engineering (PTE) team. This team is responsible for developing hardware to support all engineering development and production test activities at Qualcomm.
In this role, the mechanical engineer is responsible for collaborating with multiple global engineering teams to ensure the overall design of hardware in support of product characterization and test of semiconductor devices.
The mechanical engineer is expected to play a key role in designing hardware that considers aspects of the overall design from the perspective of how the designs will function within the target test platform. Some example tasks include:
Extensive use of 3D CAD modeling software to design mechanical hardware and fixtures that support multiple semiconductor test engineering platforms that include: wafer-probe, automated test equipment (ATE), different types of chipset integration development platforms, and system-level test platforms (SLT), among others.
Generate models and drawings for new IC semiconductor package architectures. Requires capturing design intent and reconciling package design with target test platforms to ensure usability.
Leverage computational analysis engineering (CAE) software tools such as Ansys Workbench, Mechanical, Icepak, Solidworks Simulation, Creo Simulation
Utilize product lifecycle management software tools for generating engineering change orders (ECOs)
Ability to clearly communicate and collaborate with engineering leads to capture relevant design requirements

Requirements

• Bachelor's degree in Mechanical Engineering or related field.

Nice To Haves

• 1 + years’ experience in the following areas:
• Knowledge of semiconductor test cell technology and operation and associated hardware design experience
• Background in mechanical design, part fabrication techniques, application of geometric tolerancing and dimensioning (GD&T) best practices per ASME Y14.5-2009,
• Proficiency using Creo Parametric 3D modeling CAD software tool utilizing top-down assembly methodologies
• Intermediate experience using ANSYS simulation software tools (e.g. Mechanical, Icepak)
• Experience conducting tolerance stack-up analysis on complex assemblies
• Familiarity with Agile product life-cycle management tool
• IC socket design or experience is a plus
• Excellent English and communication

Responsibilities

• Extensive use of 3D CAD modeling software to design mechanical hardware and fixtures that support multiple semiconductor test engineering platforms that include: wafer-probe, automated test equipment (ATE), different types of chipset integration development platforms, and system-level test platforms (SLT), among others.
• Generate models and drawings for new IC semiconductor package architectures. Requires capturing design intent and reconciling package design with target test platforms to ensure usability.
• Leverage computational analysis engineering (CAE) software tools such as Ansys Workbench, Mechanical, Icepak, Solidworks Simulation, Creo Simulation
• Utilize product lifecycle management software tools for generating engineering change orders (ECOs)
• Ability to clearly communicate and collaborate with engineering leads to capture relevant design requirements

Benefits

• competitive annual discretionary bonus program
• opportunity for annual RSU grants
• highly competitive benefits package is designed to support your success at work, at home, and at play.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Number of Employees: 5,001-10,000 employees