Mechanical Engineer: RF Subsystems

HRL Laboratories•Calabasas, CA

7d•$128,000 - $159,950

About The Position

HRL Laboratories’ Sensors and Electronics Lab is seeking a mechanical engineer to help develop advanced RF technologies. The engineer will work on diverse teams and take responsibility for the design, FEA modeling, implementation, and integration of mechanical and thermal solutions for advanced RF prototypes. The role is primarily focused on mechanical and thermal design, while also requiring a broad skill set across mechanical engineering, electronics, and programming. The engineer will support senior staff scientists and engineers throughout the product development cycle. HRL develops radiofrequency, millimeter-wave, and electro-optical sensors using advanced materials and device fabrication processes. Its solutions are highly integrated and optimized for size, weight, and power efficiency, with applications in automotive, aerospace, and defense.

Requirements

Bachelor’s or master’s degree in mechanical engineering or a relevant field.
At least 4 years of experience designing, implementing, and testing mechanical assemblies and/or thermal management systems.
Proficiency with SolidWorks to create detailed 3D models and technical drawings of components and assemblies.
General knowledge of GD&T and how it relates to processing methods.
Experience with FEA analysis tools such as Ansys or COMSOL.
Working knowledge of mechanical and thermal design principles from component to subsystem level, including operation, controls, and safety.
Understanding of structural and thermal analysis and fluid dynamics.
Familiarity with MILSPEC standards and qualification of hardware for DoD applications.
Proficiency using computers, engineering workstations, and complex electronic equipment; strong oral and written communication; ability to interact with vendors and colleagues; and willingness to work in a fast-paced, deadline-driven environment.
Ability to work well both in a team and independently.
Working knowledge of electronic parts and components, including connectors, cables, printed circuit boards, and device packages.
U.S. citizenship and ability to obtain and maintain a U.S. Government security clearance.
Ability and willingness to travel 20% of the time.
Sufficient mobility to work within confined spaces, with visual and hearing acuity.

Nice To Haves

Current security clearance.
Understanding of ASME Y14.5 and ASME Y14.100.
Basic understanding of electronic and/or RF components and systems.
Product life-cycle, vibration, and environmental testing experience.

Responsibilities

Work with RF and electrical engineering teams to design, simulate, integrate, and test mechanical and thermal assemblies to meet customer requirements.
Perform mechanical-system simulations, including FEA of CAD components and assemblies, and electronics-system simulations, including SPICE simulations, for electronics and RF subsystems.
Prepare design specifications, component and assembly drawings, tolerance analyses, and interface control documents; apply GD&T and develop system assembly instructions.
Integrate and validate system hardware in a laboratory environment.
Contribute to software development to monitor, control, and acquire data from RF subsystems.
Support design reviews and implement design-for-manufacturing and design-for-assembly principles.
Perform or coordinate fabrication and testing of assemblies.