Engineer/Principal Engineer Digital-RF Subsystems I&T

Northrop Grumman•Baltimore, MD

3d•$96,300 - $179,400•Onsite

About The Position

Northrop Grumman Missions Systems’ AMS E&S organization in Baltimore, Maryland, is seeking individual-contributor Digital-RF subsystem integration and test engineers to support subsystem development, controls integration, and verification. The role focuses on digital and RF subsystem integration and test, particularly controls integration spanning FPGA and embedded software implementation on system-on-chip FPGA platforms. Work is performed with general direction from technical leads, using sound engineering judgment to execute objectives and solve technical problems. The successful candidates will work with a multidisciplinary engineering team developing cost-effective systems across program lifecycles. The roles are contingent on program award and require a current, active government Secret clearance. This dual-level opening considers candidates for Engineer (level 2) or Principal Engineer (level 3), based on the applicable qualifications. Travel is approximately 10%. Relocation assistance may be available.

Requirements

Must hold a current, active Secret or Top Secret security clearance.
Engineer level: Bachelor's degree in Engineering or a related discipline and 2 years of relevant experience, or a Master's degree and 0 years of experience; an additional 4 years of experience may substitute for the degree.
Principal Engineer level: Bachelor's degree in Engineering or a related discipline and 5 years of relevant experience, or a Master's degree and 3 years of experience, or a Ph.D. and 0 years of experience; an additional 4 years of experience may substitute for the degree.
Experience using MATLAB, Python, or similar engineering analysis tools.
Experience with digital and/or RF subsystem integration and test or design.
Experience supporting hardware bring-up, verification, or troubleshooting activities.
Principal Engineer level: Experience integrating or troubleshooting FPGA, embedded software, or system-on-chip FPGA-based hardware.
Ability to communicate effectively and clearly present technical approaches and findings.
U.S. citizenship is required for positions requiring a government clearance.

Nice To Haves

TS/SCI clearance.
SAP clearance.
Strong knowledge of setting up laboratory, system integration, and Digital-RF hardware test environments.
Strong knowledge of control architectures and controls integration for hardware with firmware, embedded software, and system-on-chip FPGAs.
Knowledge of RF and antenna theory, including RF performance analysis.
Knowledge of Python.
Knowledge of VHDL/Verilog.
Knowledge of C/C++.
Test development experience for laboratory test environments and subsystem hardware.
Experience troubleshooting digital-RF subsystems.
Understanding of digital signal processing chains.
Experience working with and supporting engineers across firmware, software, power, and RF test teams.
Experience with system-on-chip FPGA integration and bring-up, embedded software and controls integration, or controls verification across hardware, firmware, and software boundaries.
Experience with highly integrated Digital-RF subsystems and antenna hardware for AESA systems; electronic warfare, radar, communications, or related mission-system principles; test or design readiness reviews; concept-of-operations development; or subsystem and system-level testing in engineering development or manufacturing environments.

Responsibilities

Integrate Digital-RF subsystem hardware and representative laboratory test environments.
Integrate new equipment and programs in a state-of-the-art facility.
Develop software to automate test processes, verify controls, and analyze data.
Troubleshoot digital, embedded software, FPGA, and RF issues during subsystem integration and test.
Analyze test data and identify early trends.
Support program meetings in developing root causes and corrective actions.
Collaborate with design engineering to improve hardware, controls, firmware, embedded software, and testing.
Analyze subsystems, including digital architecture, signal paths, and hardware interfaces from the RF front end through digital processing.
Support performance testing and requirements verification.
Support system-on-chip FPGA integration and bring-up, controls integration, and subsystem/system-level testing as applicable.

Benefits

Health insurance coverage.
Life insurance.
Disability insurance.
Savings plan.
Company-paid holidays.
Paid time off (PTO) for vacation and/or personal business.
Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus.
Annual bonuses designed to reward individual contributions and allow employees to share in company results.
Vice President or Director employees may be eligible for long-term incentives.
Relocation assistance may be available.