Mechanical Engineer II

Firefly Aerospace•Cedar Park, TX

19d

About The Position

Firefly Aerospace is seeking an Avionics Mechanical Engineer to design, analyze, build, integrate, and support testing of electronics enclosures, mechanical components, integration hardware, tooling, and test fixtures for launch vehicles and spacecraft. The role is part of the avionics team and involves collaboration with teams across the company. The engineer will develop ruggedized electronics packaging and electromechanical assemblies for aerospace thermal, dynamic, EMI/EMC, and radiation environments. The position also includes performing thermal, modal, and vibration analyses; designing test fixtures and ground support hardware; supporting environmental test campaigns; and producing CAD models, drawings, and technical documentation. The engineer will coordinate with the PCB design team on mechanical and thermal interface requirements. Applicants must meet U.S. Government space technology export-control eligibility requirements. Firefly Aerospace is an Equal Opportunity Employer.

Requirements

Bachelor of Science in mechanical engineering, aerospace engineering, or a related field.
At least 3 years of engineering experience designing electronics packaging and electromechanical assemblies through internships, professional industry experience, or academia.
At least 3 years of 3D CAD design and drafting experience.
Must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain required U.S. Department of State authorizations for compliance with U.S. Government space technology export regulations, including ITAR.

Nice To Haves

Hands-on experience designing and integrating electronics packaging.
Proficiency with NX or similar CAD software and analysis tools such as ANSYS.
Experience with multi-layer PCBA enclosure design.
Experience with electronics mechanical-packaging features and calculations, including vent analyses, EMI/EMC mitigation strategies, multi-component tolerance stack-up calculations, bolt-load calculations, and Steinberg PCB solder-joint fatigue.
Understanding of basic launch vehicle subsystems and how avionics integrate within the vehicle and interface with instrumentation.
Experience designing for CNC machining and sheet metal production, and selecting appropriate materials and finishing processes.
Experience with environmental analysis and testing, including thermal cycle, thermal vacuum, shock, and vibration.
Understanding and knowledge of GD&T.

Responsibilities

Design ruggedized electronics packaging and structural components for PCB assemblies used in launch vehicle and spacecraft applications.
Design electromechanical assemblies for thermal and dynamic environments, EMI/EMC compatibility, and radiation resistance.
Perform steady-state thermal and thermal-cycling analyses of electronics in aerospace environments.
Perform modal and vibration analyses of electronic assemblies with mechanical and structural components.
Design test fixtures and ground support hardware for launch vehicle and spacecraft electronics.
Support vibration, shock, and thermal testing of designed products.
Develop CAD designs, part drawings, assembly drawings, and technical documentation, including presentations and reports.
Coordinate with the PCB design team on mounting strategies, mechanical keep-outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces to the PCB assembly.