Mechanical Engineer II

RTX•Goleta, CA

6d•$75,800 - $144,200•Onsite

About The Position

Raytheon is seeking a Mechanical Engineer II to join a talented team delivering new product development and enhancements within the Electronic Warfare Mechanical Design Hardware Section. The section specializes in the design, integration, verification, and production of digital processor and RF receiver subsystems for airborne platforms. The candidate participates in the mechanical development and enhancements for supporting a variety of programs in Goleta, California. Key interfaces will be with other sections across the department, other engineering disciplines, as well as internal customers leading the supporting programs. This is an onsite position located in Goleta, CA. Occasional travel may be required to other Raytheon facilities and suppliers or customer sites.

Requirements

Master's degree in Mechanical Engineering, Aerospace, Engineering Science, Physics, Math, or related (STEM) major obtained by start date.
Coursework and/or experience with the following: Calculus, Differential Equations, Physics (calculus based), Statics, Dynamics, Mechanics of materials, Thermodynamics, Heat transfer
Experience with Geometric Dimensioning and Tolerancing (GD&T) and ASME drawing and documentation standards and procedures.
Experience may be obtained through on-the-job experience, research, coursework, or projects
The ability to obtain and maintain a U.S. government issued security clearance is required.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
Active and existing security clearance required after day 1

Nice To Haves

Coursework and/or experience with any of the following: Mechanical engineering within a product development lifecycle in design, packaging, manufacturing support, and/or hardware integration and testing.
Creating and documenting mechanical designs in CREO or similar modeling tools.
Experience in Structural and thermal analysis using FEA modeling techniques.
Experience in Conformal Antenna Array Packaging. Electronics packaging, cabling and harness design, and printed wiring board designs and routing.

Responsibilities

Work together with more senior team members in designing RF systems for challenging thermal and high vibration environments.
Electronics packaging design.
Assignments may involve thermal and structural design and analysis, electrical component design, construction and failure modes, printed wiring board and circuit card assembly processes and best practices, surface mount and through hole component installation processes and failure modes, metal fabrication and finishing methods, RF isolation mechanical design, and environmental test methods and equipment.