Manufacturing Assembler

Teledyne Technologies Incorporated • Garland, TX

4d

About The Position

Teledyne Micropac is seeking an experienced assembler and machine operator to perform a wide variety of electronic, electro-mechanical, mechanical, or measurement product assembly operations on product components, assemblies, and sub-assemblies. The role supports high-reliability applications in satellites, medical, defense/aerospace, and industrial markets. Training takes place on first shift. After successfully completing training, the employee is expected to move to second shift, 2:30 p.m. to 11:00 p.m. A 6% shift premium is offered for second shift after training. Overtime and Saturdays may be required when needed; overtime may sometimes be mandatory.

Requirements

• Excellent manual dexterity and manufacturing knowledge.
• Experience with small parts, small hand tools, equipment, and microscopes.
• Ability to read and work from engineering drawings, work instructions, and bills of material to understand the required parts and assembly steps.
• Quality-minded work ethic, strong attention to detail, and a desire for precision and accuracy.
• High school diploma and basic computer skills.
• At least 6 months to 1 year of experience in manufacturing assembly, a production environment, or a cleanroom.
• Strong problem-solving abilities.

Nice To Haves

• Knowledge of Foreign Object Debris (FOD) control.

Responsibilities

• Follow production drawings, procedures, and work instructions in detail, applying established workmanship practices.
• Operate automatic and manual bonding equipment to perform thermosonic gold-wire and aluminum-wire bonding.
• Complete quality checks throughout manufacturing processes.
• Collaborate with teammates, quality control, and process engineers to ensure products meet strict specifications.
• Follow safety and cleanliness protocols and maintain attention to detail.
• Assist with training as required.
• Perform bond pull, die shear, and shear strength tests as determined by the supervisor.
• Assemble delicate electronic devices using solder, epoxy, and wire-bonding techniques, specifically under microscopes.
• Inspect completed work to ensure it meets quality requirements.

Benefits

• Competitive pay and comprehensive health benefits.
• 401(k) with company match and retirement plans.
• Paid time off and flexible work arrangements.
• Professional development and training opportunities.
• Employee wellness programs and assistance resources.
• Collaborative environment working on mission-critical technology.
• 6% second-shift premium after successful completion of training.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: High school or GED