Manager, Mechanical Engineering - Electronics Packaging

Marotta Controls•Parsippany, NJ

1d•$132,000 - $165,000•Onsite

About The Position

The Engineering Manager leads day-to-day execution of mechanical design activities supporting ruggedized electronics packaging within the PAS business unit. This role is responsible for team management, program-level execution, and adherence to established Marotta-internal structural, thermal, vibration, EMI/EMC, and IPC Class 3 design standards. Additionally, this role participates in the development and maintenance of mechanical engineering procedures, reference manuals, and design standards.

Requirements

Bachelor’s degree in Mechanical, Aerospace, or related discipline.
8+ years aerospace/defense experience.
Demonstrated experience designing electronics packaging for harsh environments (vibration, shock, thermal cycling).
Experience with structural, vibration, and shock design.
Experience with thermal management design (conduction, convection, radiation cooling methods).
Working knowledge of IPC Class 3 requirements for CCA/PCB design and manufacturability.
Familiarity with EMI shielding, grounding, and environmental sealing techniques.
Familiarity with connector selection for aerospace applications.
Working knowledge of thermal, structural, and vibration analysis principles; familiarity with FEA tools.
Proficiency with 3D CAD systems (PTC Creo preferred).
Working knowledge of environmental qualification standards (MIL-STD-810, MIL-STD-461, DO-160, etc.).
Strong written and verbal communication skills.
Must be a U.S. citizen.

Nice To Haves

Master’s degree in Mechanical, Aerospace, or related engineering discipline.
3+ years leadership/management experience.
Direct experience with flight-critical control actuation systems and power systems.
Experience leading programs through environmental qualification and production release.
Active, or eligible for, U.S. security clearance.

Responsibilities

Assign and manage packaging-engineering design tasks and resources.
Ensure design compliance with customer/ contractual performance requirements.
Oversee execution of thermal, structural, and vibration/shock analysis.
Oversee ruggedized electronics design (Thermal, structural, CCA, PCB, DFM, etc.).
Ensure IPC Class 3 mechanical integration practices.
Ensure EMI shielding and grounding implementation as appropriate.
Ensure application of environmental sealing techniques as appropriate.
Drive disciplined execution through gated reviews (SRR, PDR, CDR, TRR, FCA/PCA).
Participate and drive closure in failure investigation, root cause analysis, and corrective action (FRACAS) activities.
Support proposal efforts with credible technical, labor, and schedule inputs and risk assessments.
Maintain AS9100 compliance and audit readiness within the mechanical discipline.
Spearhead electronic packaging-related issue resolution.
Escalate systemic risks appropriately.
Enforce mechanical engineering procedures and documentation controls.
Ensure AS9100 compliance at team level.
Institutionalize lessons learned into formal design guidance.
Improve repeatability, documentation quality, and configuration control discipline.
Ensure analysis assumptions and modeling practices are standardized and traceable.
Participate in development, maintenance, and enforcement of mechanical engineering procedures and work instructions, electronics packaging design standards, engineering design reference manuals, and design review checklists and documentation controls.
Conduct performance reviews and development planning.
Mentor and develop mechanical engineers in technical rigor and execution discipline.
Provide clear performance expectations and structured feedback.
Foster cross-functional collaboration.