Lead, Electrical Engineering - Digital Hardware (Palm Bay, FL)

L3Harris•Palm Bay, FL

8d•Onsite

About The Position

L3Harris is seeking a Lead Electrical Engineer – Digital Hardware to join its team in Palm Bay, Florida. The role supports the design and development of advanced space-qualified digital hardware for mission-critical applications, including spacecraft and payload digital solutions. The position contributes to current and future programs, internal research and development efforts, and strategic growth initiatives. The successful candidate will bring expertise in spacecraft electrical digital subsystem design, including digital architecture development, circuit simulation, detailed analysis, hardware verification, and cross-functional collaboration. The role spans all phases of hardware development, from requirements analysis and architecture definition through detailed design, manufacturing, integration, and verification. The schedule is 9/80.

Requirements

Bachelor’s degree and at least 9 years of prior relevant experience; or a graduate degree and at least 7 years of prior related experience; or, in lieu of a degree, at least 13 years of prior related experience.
Ability to obtain a TS/SCI security clearance.

Nice To Haves

Experience designing and developing digital hardware systems.
Experience with high-speed or dense processing hardware architectures.
Experience with hardware integration, verification, and debug.
Experience in a collaborative engineering development environment.
Experience across mission definition, concept generation, trade studies, preliminary and final design, component selection, integration, test support, materials selection, and design documentation.
Experience developing qualified deliverable power hardware for space, aerospace, defense, medical, or other mission-critical applications.
Experience working with manufacturing and production teams in a program environment.
Experience with Root Cause Corrective Action (RCCA) and Failure Review Boards (FRB).
Experience presenting technical material to program leadership, customers, and review boards.
Strong written, verbal, and interpersonal communication skills.
Ability to collaborate effectively across technical teams and leadership levels.
Experience as a subcontract technical representative, including supplier evaluation, statement of work development, and technical oversight of external deliverables.
Experience with digital hardware design for phased array antenna systems, including beamforming control, high-speed data conversion, timing and synchronization, RF control interfaces, and mixed-signal circuit card assembly integration.
Experience in one or more of the following: space-based hardware design, high-speed digital design, FPGA-based systems, processor and memory subsystem design, DSP-based hardware, networking hardware, or mixed-signal electronics.
Experience designing, integrating, and analyzing high-speed electrical and optical interfaces and protocols, including 10/25 Gb Ethernet, PCI Express Gen 2/3/4/5, electrical-to-optical conversion, optical-to-electrical conversion, and fiber-optic transceiver integration.
Experience with ECAD and analysis tools such as LTSpice, PSpice, Cadence, Siemens Xpedition, and Hyperlynx 25.10.
Experience integrating firmware/software with hardware in lab and system environments.
MATLAB, Python, or similar programming experience for modeling, analysis, and automation.

Responsibilities

Lead the design and development of advanced digital and mixed-signal hardware using sound electrical engineering principles and best practices.
Support hardware development phases including requirements analysis, architecture definition, detailed design, schematic capture, simulation, documentation, manufacturing, integration, and verification.
Translate customer and system-level requirements into detailed electrical specifications and power architectures while balancing technical and cost considerations.
Design and analyze processor- and microcontroller-based circuits; FPGA, CPLD, and digital array designs; memory and storage interfaces; ADC and DAC interfaces; high-speed digital communication interfaces; clock generation and distribution circuits; data acquisition and control circuits; mixed-signal interfaces; and reset, monitoring, and supervisory circuits.
Perform detailed digital-circuit analysis, including timing and margin, thermal performance, signal integrity, power integrity, radiation effects, EMI/EMC, and component derating.
Troubleshoot and resolve hardware issues at component, board, module, payload, and system levels.
Use laboratory instruments to validate designs and investigate issues.
Conduct trade studies and develop conceptual digital solutions for proposals, IRAD, and new business opportunities.
Collaborate with systems, firmware, software, mechanical, manufacturing, quality, supply chain, and program leadership teams.
Evaluate component tolerances and environmental impacts to ensure robust design margins for high-reliability applications in harsh operating environments.
Support risk reduction and mitigation related to obsolescence, cost, producibility, and long-lead materials.