Layout Design Manager

Texas Instruments•Dallas, TX

About The Position

Texas Instruments is seeking a Layout Design Manager to lead a team developing power management ICs for high power density applications. This role involves people leadership, ownership of layout execution, and driving new tools and flows. Opportunities include working with advanced power packages and pushing thermal and electrical performance boundaries in cutting-edge power solutions.

Requirements

  • Deep understanding of analog and power layout techniques, including matching, symmetry, current density, electromigration, and IR drop management.
  • Experience with high-voltage design rules, isolation techniques, and device spacing for BCD/HV processes.
  • Strong knowledge of parasitic-aware layout for sensitive analog blocks such as bandgaps, references, comparators, and op-amps.
  • Familiarity with power device layout, including LDMOS, power MOSFETs, bond pads, and ESD structures.
  • Proficiency with layout tools such as Cadence Virtuoso and verification flows including DRC, LVS, PEX, and parasitic extraction.
  • Knowledge of packaging considerations, including bond wire, flip-chip, and bump layout, as they relate to PMIC layout.
  • Ability to manage schedules, resource allocation, and cross-functional coordination across design, product, process, reliability, and packaging teams.
  • Strong verbal and written communication skills for interfacing effectively with circuit designers, product engineers, and foundry partners.
  • Experience mentoring and developing junior layout engineers.
  • Demonstrated interpersonal, analytical, and problem-solving skills, with the ability to collaborate effectively across functions.
  • Ability to quickly ramp on new systems and processes, take initiative, and drive results with strong time management and on-time delivery.

Responsibilities

  • Leading a team developing power management ICs for high power density applications.
  • Adopting and driving new tools and flows across the team.
  • Working with advanced power packages.
  • Pushing the boundaries of thermal and electrical performance in cutting-edge power solutions.
  • Managing schedules, resource allocation, and cross-functional coordination across design, product, process, reliability, and packaging teams.
  • Interfacing effectively with circuit designers, product engineers, and foundry partners.
  • Mentoring and developing junior layout engineers.
  • Collaborating effectively across functions.
  • Quickly ramping on new systems and processes.
  • Taking initiative and driving results with strong time management and on-time delivery.
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