Intern - Engineer, HIG HBM DTPCO

Micron Technology • Richardson, TX

2d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality.

This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations.

Requirements

• Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.
• 3+ years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a related field.
• Hands-on experience with laboratory equipment such as oscilloscopes, SMUs, power supplies, thermal systems, probe stations, or automated test hardware.
• Programming experience in Python and at least one additional language such as C/C++ or Verilog.
• Experience analyzing complex datasets and driving root-cause investigations using statistical and engineering methods.

Nice To Haves

• Master's or PhD degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related field.
• Experience with DRAM, HBM, memory subsystems, advanced semiconductor packaging, or silicon characterization.
• Knowledge of thermal, mechanical stress, reliability, yield improvement, DOE methodologies, and power-performance correlation techniques.
• Experience working with MBIST analysis, parametric characterization, failure signatures, and semiconductor test methodologies.
• Proficiency using AI-enabled tools, Agentic AI, Generative AI, or AI-assisted coding platforms (e.g., Claude Code, Code Assist) to improve engineering productivity, data analysis, and workflow automation.

Responsibilities

• Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards.
• Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, timing margin evaluation, and failure-onset analysis.
• Develop and maintain Python-, Verilog-, and C/C++-based test programs, stress patterns, workloads, and observability features to accelerate root-cause investigations and improve characterization efficiency.
• Analyze MBIST signatures and multifaceted electrical, thermal, and mechanical datasets to identify root causes related to design, process, package, assembly, or test interactions, and recommend corrective actions.
• Leverage AI, Agentic AI, and Generative AI tools to improve engineering workflows, data analysis, test development efficiency, and problem-solving effectiveness.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Intern