About The Position
In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.
Requirements
- BS and a minimum of 10 years relevant industry experience or equivalent
- Proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS.
- Familiar with development process of simulation and characterization projects.
Nice To Haves
- Proven capability in mechanics and mathematics.
- Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
- Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python.
- Hands-on experience of Gen-AI and Machine Learning.
- Deep understanding of packaging materials and their mechanical behaviors.
- Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
- Able to perform independent research and development work.
- Excellent written and verbal communication skills with ability to present ideas, design concepts, data, and plan with high confidence at team meetings.
Responsibilities
- Working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
- Working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Number of Employees
5,001-10,000 employees
