As a member of the Mixed-Signal ASIC Implementation team, you will be part of the team implementing new technologies from various exciting extremely low-power consumer electronic devices to high-performance Satellite projects. In addition, you will be directly involved with the following: Leading and implementing chips in various high-volume consumer devices to Satellite projects from ultra-low power 40nm nodes, 16nm to 7nm. Physical implementation of the blocks and top-level. Floorplanning including multi-power domain, PG planning, block-shaping & clock-tree implementation Interfacing with internal and external teams, including Design, IPs, and Library Physical Verification for block and chip-level Static and Dynamic IR drop Analysis. Signal and Power EM checks Methodology & Flow development of Physical Design & Timing Closure Working independently with the Synthesis & STA owners and RTL design team on Physical implementation and Power-intent requirements Knowledge of ESD, IO padring, Analog integration, and exposure to various types of packages, including flip-chip, wlcsp is a plus. Knowledge of AI tools preferable.
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Job Type
Full-time
Career Level
Senior