Module Engineering - Day Shift 5 or 7

Intel•Chandler, AZ

1d•Onsite

About The Position

Intel's Foundry Technology Manufacturing business unit is seeking a Foundry Packaging Module Engineer to join its operations in Chandler, Arizona. The engineer will develop and optimize assembly processes and equipment, applying innovative concepts to enable next-generation foundry packaging platform technologies. The role works across engineering, manufacturing, and technology development to deliver packaging solutions, evaluate silicon and package technologies under simulated field conditions, and manage raw material specifications for foundry customers. The role is onsite and offers compressed day-shift schedules. Shift 5 runs 6:00 AM–6:00 PM Sunday through Tuesday and alternating Wednesdays; Shift 7 runs 6:00 AM–6:00 PM Thursday through Saturday and alternating Wednesdays. The posting identifies Shift 7 as the shift for this position. This position is not eligible for Intel immigration sponsorship.

Requirements

Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a STEM-related field, plus at least 1 year of relevant experience; or a master's degree in one of these fields.
At least 6 months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Customer-centric approach and interest in delivering specialized technical solutions to external foundry customers.
Analytical problem-solving skills, including diagnosing mechanical, thermal, and materials-related packaging defects.
Ability to collaborate across matrixed teams, global engineering groups, and external supplier networks.
Personal initiative to lead continuous improvement projects and adapt to changing product priorities.

Nice To Haves

At least 1 year of experience working in a technology development or semiconductor manufacturing environment.
Experience with semiconductor packaging processes, including assembly, material selection, or reliability engineering within a foundry context.

Responsibilities

Design and develop assembly processes and hardware configurations to advance Intel's foundry packaging roadmap.
Develop, calibrate, and maintain equipment used to evaluate silicon and packaging technologies under simulated field conditions, including thermal cycling, heat, humidity, and mechanical stress.
Establish raw material specifications for contract assemblers and material vendors, partnering with supplier quality and procurement to enforce process compliance.
Create and implement reliability screening techniques, acceleration methods, and quality screens to detect potential packaging defects early.
Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to define equipment specifications, optimize yields, and document results in technical white papers.
Ensure physical layout designs are manufacturable within foundry process flows and oversee package manufacturing procedures.
Serve as a technical resource for foundry packaging challenges, respond to customer and partner requests, and provide guidance on process improvements.
Drive standardization across product qualification frameworks and manufacturing quality systems, engaging technology development teams to mitigate product milestone risks.