Module Engineering - Day Shift 5 or 7

Intel Corporation•Chandler, AZ

3d•$99,030 - $139,810•Onsite

About The Position

Intel is seeking a Foundry Packaging Module Engineer for its Foundry Technology Manufacturing operations in Arizona. The role develops and optimizes assembly processes and equipment to advance next-generation foundry packaging platform technologies. Working across engineering, manufacturing, and technology development, the engineer helps deliver packaging solutions, evaluates silicon and package technologies under simulated field conditions, and manages raw material specifications for foundry customers. The position is on-site and offers compressed day-shift schedules. Shift 5 runs 6:00 AM–6:00 PM Sunday–Tuesday and alternating Wednesdays; Shift 7 runs 6:00 AM–6:00 PM Thursday–Saturday and alternating Wednesdays. The listed assignment is Shift 7.

Requirements

Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a STEM-related field, plus at least 1 year of relevant experience; alternatively, a master's degree in one of these fields or a STEM-related field.
At least 6 months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Relevant experience may be obtained through schoolwork, classes, project work, internships, military training, and/or work experience.
Position is not eligible for Intel immigration sponsorship.

Nice To Haves

At least 1 year of experience working in a technology development or semiconductor manufacturing environment.
At least 1 year of experience with semiconductor packaging processes, including assembly, material selection, or reliability engineering within a foundry context.

Responsibilities

Design and develop assembly processes and hardware configurations using engineering concepts to advance Intel's foundry packaging roadmap.
Develop, calibrate, and maintain equipment used to evaluate silicon and packaging technologies under simulated field conditions, including thermal cycling, heat, humidity, and mechanical stress.
Establish raw material specifications for contract assemblers and material vendors, partnering with supplier quality and procurement to enforce process compliance.
Create and implement reliability screening techniques, acceleration methods, and quality screens to detect potential packaging defects early.
Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to define equipment specifications, optimize yields, and document results in technical white papers.
Ensure physical layout designs are manufacturable within foundry process flows and oversee package manufacturing procedures.
Provide technical guidance on foundry packaging challenges and respond to customer and partner requests with process-improvement guidance.
Standardize product qualification frameworks and manufacturing quality systems, working with technology development teams to mitigate product milestone risks.