Firmware Engineering Intern

Hewlett Packard Enterprise•Sunnyvale, CA
•$40 - $46•Onsite

About The Position

Firmware Engineering Intern This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Requirements

  • Working towards a Bachelor's and/or Master's degree with a focus in Engineering, Computer Science, or other related technical field.
  • Domain knowledge in software and security engineering, including software signing
  • Familiarity with open-source usage; must understand the concept of code provenance and how to maintain it over time
  • Strong knowledge of Linux and FreeBSD kernel.
  • Coding proficiency in the C/C++, Python, RUST programming language with ability to learn others, as necessary.
  • Excellent problem-solving skills
  • Excellent written and verbal communication skill
  • BS or MS degree in Computer Engineering, Computer Science, or related degree or equivalent experience.

Nice To Haves

  • Familiarity with different CPU architectures and knowledge on Hardware Root of Trust (HRoT) is a plus.
  • Familiarity with TPM 2.0 and devID technology as specified by Trust Computing Group (TCG)
  • Familiarity with Post Quantum computing technology and different signature algorithms such as ML-DSA is a plus

Responsibilities

  • Participate in design and development of key signing infrastructure enhancements.
  • Participate in design and development of product security features using TPM 2.0 security chip

Benefits

  • Health & Wellbeing
  • Personal & Professional Development
  • Unconditional Inclusion
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