Embedded Design Engineering Intern – Firmware

Leidos•Huntsville, AL
•$48,100 - $86,950

About The Position

Leidos Defense Systems is seeking an Embedded Design Engineering Intern to join its Electrical Systems Department. The intern will learn about all phases of the product life cycle, from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. Learning opportunities include digital-signal processing (DSP) design, printed circuit board (PCB) design, technical trade studies, and evaluation of technology improvements. The internship is part of Leidos’ defense and aerospace student program, which provides hands-on experience and opportunities for technical growth.

Requirements

  • Currently enrolled in an accredited college or university and pursuing a degree in Computer Engineering or a related field.
  • Experience with C, C++, or Rust embedded software programming through coursework, lab projects, or previous internships.
  • Demonstrated problem-solving, teamwork, and communication skills.
  • GPA of 3.0 or higher.
  • Include a resume and unofficial transcripts with the application.
  • Must be a U.S. citizen and able to obtain and maintain a DoD Secret security clearance.

Nice To Haves

  • Experience or working knowledge of modern Xilinx FPGA and SoC families and design tools, including RFSoC, Xilinx IP Cores, AXI4, and AXI-Stream.
  • Basic knowledge of FPGA/firmware languages, including VHDL, Verilog, SystemVerilog, assembly, or Rust.
  • Experience with simulation and test frameworks.
  • Knowledge of RISC microprocessor architectures, such as ARM Cortex, MicroBlaze, PowerPC, or RISC-V.
  • Knowledge of memory architectures, types, and caching.
  • GNU/Linux experience and kernel-driver development.
  • Knowledge of communication protocols such as UART, Ethernet, SPI, I2C, and CAN bus.
  • Experience with embedded operating systems such as Linux, VxWorks, Integrity, FreeRTOS, Zephyr, or uC/OS-II.
  • Electronics and PCBA design experience.
  • Experience leading design teams, including technical leadership, budgeting, and scheduling.

Responsibilities

  • Design embedded software and firmware.
  • Perform HDL simulations and software unit tests.
  • Conduct hands-on laboratory testing using instrumentation, test equipment, and debug/test methods.
  • Work collaboratively with multidisciplinary engineering teams.
  • Work with platforms such as FPGAs, microcontrollers, microprocessors, and mixed-signal designs.
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