Field Application Engineer - Power Interconnect

Amphenol and its Affiliated Companies
$130,000 - $160,000Hybrid

About The Position

The Field Application Engineer (FAE) – Power Interconnects will provide technical support and application expertise across North America for Amphenol’s power-to-board and power-to-rack connector solutions and liquid cooling used in AI server, data center, and high-performance computing (HPC) applications. This individual will be a key technical interface between customers, sales, and product development teams, ensuring that Amphenol’s interconnect technologies meet the evolving power distribution needs of next-generation AI architectures. The role includes collaboration with hyperscale, OEM, and rack integration customers, as well as participation in industry initiatives related to high-density power delivery and AI system infrastructure standards. You will be expected to develop new business and drive new product development needs to meet the markets' technology trends, by working internally with global Product Management, Business Development and Engineering.

Requirements

  • Bachelor’s degree in Electrical, Mechanical, or Mechatronic Engineering (Master’s preferred).
  • 3–7 years of experience in connector design, power electronics, or related hardware integration roles.
  • Customer-facing or field engineering experience required.
  • Deep technical understanding of power electronics, high-current interconnects, and thermal management.
  • Proficiency in electrical and mechanical CAD tools (e.g., Creo, SolidWorks, AutoCAD).
  • Working knowledge of electrical performance metrics such as current carrying capacity, contact resistance, derating, and impedance.
  • Ability to interpret electrical schematics, 3D models, and mechanical drawings.
  • Strong interpersonal, presentation, and communication skills for customer and cross-functional engagement.
  • Proficiency with Microsoft Office.

Nice To Haves

  • Experience in AI data centers, rack power distribution, cooling systems, or server platform engineering strongly preferred.
  • Prior involvement with industry standards or consortiums (OCP, PCIe, or similar) a plus.
  • Familiarity with AI compute racks, GPU servers, and power delivery architectures (e.g., 48V, blind-mate power, busbars) highly desirable.
  • Ability to speak Mandarin highly desired
  • Location in or near Bay area (CA)
  • Prefer candidate come from Data Center company focus on hardware.
  • Proficiency in engineering simulation tools (e.g., ANSYS, SPICE, or equivalent) nice to have.

Responsibilities

  • Support AI and data center customers in the design, development, and integration of Amphenol power connector solutions into rack, server, and board-level systems.
  • Translate customer specifications and requirements into interconnect designs, collaborating closely with internal engineering and manufacturing teams.
  • Provide technical leadership in power delivery standards and participate in relevant working groups (e.g., OCP, ODCC, or hyperscaler-specific initiatives).
  • Drive innovation in connector technologies for high-current, low-resistance, and high-reliability applications.
  • Partner with sales and business development to provide technical insight during design-in and qualification phases.
  • Conduct field validation, performance testing, and troubleshooting at customer sites or Amphenol labs.
  • Act as the voice of the customer to inform future product roadmap and technology direction.
  • Maintain up-to-date awareness of AI hardware trends, including rack density, power efficiency, and modular architecture developments.

Benefits

  • Global manufacturing, design, sales, and marketing locations
  • High-reliability power and signal connectors
  • Interconnection systems designed specifically for harsh environments and high performance
  • Solutions for diverse, high-growth industrial sectors
  • Addressing modern power and signal requirements and emerging system technology needs
  • High-amperage power interconnects utilizing proprietary RADSOK® contact technology
  • Ruggedized circular, rectangular interconnects and board level contacts
  • Advanced power distribution including value-add box builds, custom-engineered cable assemblies and overmolded harnesses
  • Over 2500 skilled staff
  • Growing international footprint
  • Eight key manufacturing sites in North America, Asia-Pacific, Europe, and the Middle East providing localization for our customer base
  • Consistently meets the highest global standards of quality, product performance, design capabilities, and regionalized technical and sales support
  • Business unit of Amphenol Corporation (NYSE: APH), a global leader in the electronics revolution
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