FIB-TEM Automation Engineer

Micron Technology•Boise, ID

1d•Onsite

About The Position

Micron Technology’s Innovation, Technology and Products Group in Boise, Idaho, operates a TEM lab with advanced transmission electron microscopes and focused ion beam machines used to image and analyze memory devices. The FIB-TEM Automation Engineer in the DTG TEM lab will develop and implement automated FIB-TEM workflows, collaborating with DRAM Technology Development research teams on new processes and materials and with Fab engineers to accelerate product transfers and support yield improvement. The successful applicant will be placed at the corresponding Engineer level based on education and relevant experience in FIB/TEM automation and analytical TEM. The role includes daily FIB lamella preparation and TEM analysis, developing and adopting advanced techniques with an emphasis on AI and automation, and contributing to lab procedure improvements. The engineer will also collaborate with process development teams to solve problems in new part and module development and improve the efficiency of FIB/TEM data acquisition and processing. Shift handoffs are part of the role.

Requirements

Ph.D. degree in Materials Science & Engineering, Physics, or a semiconductor-related field, or equivalent experience.
Strong hands-on experience in FIB lamella preparation.
Analytical TEM expertise, including atomic-resolution STEM, EELS, and 4D-STEM.
Strong AI and data science skills applied to FIB-TEM workflows, such as AI-augmented model training or machine-learning-based analysis.
Proficient programming skills using Python or iFast.
A strong teamwork mindset and a collaborative, solution-oriented approach.

Nice To Haves

A consistent track record demonstrating innovation, ownership, and a hard-working attitude.
Ability to work independently or in teams, as needed.
Proven ability to simplify complex technical problems and provide clear, actionable direction.
Strong communication skills and the ability to build effective peer and customer relationships.
Demonstrated ability to quickly learn new skills and mentor or coach others effectively.

Responsibilities

Perform daily FIB lamella preparation and TEM analysis, including microstructure and chemical analysis using iFast/AutoTEM scripts, electron diffraction, EDS, and EELS, to support Micron TD and manufacturing activities.
Develop or adopt advanced FIB/TEM techniques, emphasizing AI/automation workflows for semiconductor process applications.
Provide detailed pass-down information to the next shift to support smooth shift transitions.
Contribute to optimizing existing lab procedures.
Work closely with process development teams to solve problems in new part and module development.
Develop or adopt solutions that improve the efficiency of FIB/TEM data acquisition and processing.