Engineer I - Test

Microchip•Hauppauge, NY
•Onsite

About The Position

Microchip’s USB and Networking Group is looking for a Senior Test Engineer-II to join our Test team and help to support new product and sustaining test engineering covering a wide-range of digital and mixed-signal devices. Perform test program development (program, pattern), debug, program characterization, and Silicon validation for NPI. Perform platform conversions from one ATE platform to another platform. Identifies and implements value engineering activities to improve test H/W & S/W for cost effectiveness. Lead cross-functional teams to perform key engineering tasks in test S/W engineering for mature and new products. Provide technical leadership in resolving test S/W and/or H/W issues. Provide tactical engineering support to contract manufacturers.

Requirements

  • Bachelor’s or Master’s degree in Electronics or Electrical Engineering with 0 - 2.5 years of experience in semiconductor IC development
  • Strong understanding of digital and analog circuits, from transistor to system level.
  • Hands-on experience with ATE hardware/software development (e.g., Diamond X, J750, Uflex).
  • Expertise in silicon development, validation, qualification, and correlation methodologies.
  • Advanced statistical data analysis skills; proficiency in scripting languages (e.g., Perl) and tools (e.g., YieldHub).
  • Familiarity with version control systems (GIT, SVN, Perforce).
  • Proficient in Linux/Unix and Windows environments.
  • Skilled in using bench lab equipment (oscilloscopes, voltmeters, etc.).
  • Experience working with customers to address technical and logistical concerns
  • Test programming skills on ATE platform with experience on TP development including tester platform conversion/migration.
  • Semiconductor test techniques experience in digital & mixed signal.
  • Test Hardware (L/B or DIB board) schematic review and debugging knowledge.
  • Applied programming skills on C, C++, and VB programming languages.
  • Good knowledge of IC packaging, testing, manufacturing process technologies
  • Familiar with device qualification, silicon validation and test H/W & S/W development
  • Excellent analytical, project management, communication and interpersonal skills
  • Fluent in spoken and written English
  • Ability to work with various groups located in all parts of the world
  • Ability to drive system and process implementation
  • Team player, flexible and results oriented

Nice To Haves

  • Hands on knowledge in new product test development is desirable
  • Knowledge of IC design, test development tools and wafer fab process preferred
  • Ability to perform loadboard schematic design is a strong advantage

Responsibilities

  • Perform test program development (program, pattern), debug, program characterization, and Silicon validation for NPI
  • Perform platform conversions from one ATE platform to another platform
  • Identifies and implements value engineering activities to improve test H/W & S/W for cost effectiveness
  • Lead cross-functional teams to perform key engineering tasks in test S/W engineering for mature and new products
  • Provide technical leadership in resolving test S/W and/or H/W issues
  • Provide tactical engineering support to contract manufacturers

Benefits

  • competitive base pay
  • restricted stock units
  • quarterly bonus payments
  • health benefits that begin day one
  • retirement savings plans
  • industry leading ESPP program with a 2 year look back feature
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