Electrical Test Failure Analysis Technician

TTM•North Jackson, OH

2d•Onsite

About The Position

The Electrical Test Failure Analysis Technician performs deep-dive diagnostic testing and root-cause analysis on bare printed circuit boards (PCBs) that fail standard electrical checks. This role bridges the gap between raw testing and quality engineering, ensuring manufacturing defects are accurately diagnosed to prevent future production defects.

Requirements

2+ years of electronics testing experience, with a proven track record in failure analysis or advanced troubleshooting.
Deep understanding of PCB construction, netlists, trace routing, IPC standards (such as IPC-A-600 or IPC-9252).
Mastery of bench diagnostic tools (scopes, meters, TDR testers), and specialized bare-board testing software.
Strong problem-solving skills with a methodical approach to isolating complex, multi-layer electrical failures.
Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognition of Foreign Person visitors by badge differentiation; c) understand and follow authorization procedures for bringing foreign visitors into facilities (VAL); d) understand the Export and ITAR requirements for shipments leaving the US; e) manage vendor approvals for ITAR manufacturing and services.

Nice To Haves

Associate degree in Electronics Technology, Electrical Engineering, or a highly related technical field preferred.

Responsibilities

Isolate and analyze electrical faults (such as intermittent opens, micro-shorts, high resistance, and dielectric breakdowns) on rejected bare boards.
Utilize advanced benchtop equipment—including digital multimeters (DMM), micro-ohmmeters, time-domain reflectometers (TDR), and visual inspection microscopes—to pinpoint the exact location and cause of a defect.
Prepare or coordinate micro-sectioning analysis when necessary to visually confirm internal layer copper defects, plating voids, or registration issues.
Work closely with CAM, process engineering, and fabrication teams to report systemic defect trends and help implement corrective actions.
Operate flying probe testers specifically to re-verify boards after manual rework or engineering modifications.
Document comprehensive failure analysis reports, maintaining traceability logs for high-reliability industries (e.g., aerospace and defense).