EEE Failure Analysis Engineer (Starlink)

SpaceX • Redmond, WA

2d • $105,000 - $145,000 • Onsite

About The Position

SpaceX is leveraging its experience in building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation and is providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We’ve only begun to scratch the surface of Starlink’s potential global impact. As we continue to upgrade and expand the constellation, we’re looking for best-in-class engineers to join the team. The Failure Analysis Engineer will interface with PCBA production, Supplier Development, Reliability, and EEE Piece Part groups. Familiarity with SMT manufacturing, EEE piece parts, and failure analysis equipment for both destructive and non-destructive analysis is required. Working directly in the Failure Analysis laboratory, this position will support the analysis of failures observed in production, determine the quality of the manufacturing process, and support investigations into nonconforming product. The goal of the team is to support this analysis through all phases of product life-cycles, including build and test of pre-production, qualification, and flight hardware, as well as supporting existing production lines. The ideal candidate is highly skilled in mechanical and electrical disciplines, hands-on, flexible, a quick learner, works well in a fast-paced environment, and possesses a can-do attitude.

Requirements

• BS in Material Science or related field
• 5+ years of experience in semiconductor, package, and/or PCBA reliability
• 3+ years of work experience Failure analysis on semiconductor packages and devices
• Comfortable working in a fast-paced, hands-on environment
• Experience with non-destructive analysis techniques such as Visual Inspection, X-Ray, CT scan, SEM, CSAM, curve tracing, etc.
• Experience with destructive analysis techniques such as Cross Section, Parallel Lapping and Polishing, dye and pry, and chemical decapsulation
• Experience with semiconductor analysis techniques OBIRCH, photo emission analysis, thermal emission analysis, FIB, etc.

Nice To Haves

• MS in Material Science or advanced degree in a related field
• 7+ years of experience in semiconductor, package, and/or PCBA reliability
• 4+ years of work experience Failure analysis on semiconductor packages and devices
• Understanding of basic electronic theory
• Experience in electrical trouble shooting
• Able to work independently and problem solve efficiently with minimal supervision
• Positive attitude and able to work well on a team
• Able to stay organized with strong attention to detail
• Proficient with Microsoft Excel, Word, and PowerPoint

Responsibilities

• Support destructive and non-destructive analyses during development and pre-production phases of hardware life-cycles, including pre-production, qualification, and flight hardware
• Support engineering in analysis of rework and recovery efforts on non-conforming hardware
• Assist with analyses into piece part failures, as well as non-conforming material
• Support efforts on First Article Inspection Reports
• Provide targeted surge support for company critical analyses or qualification test efforts

Benefits

• Company stock
• Stock options
• Long-term cash awards
• Discretionary bonuses
• Employee Stock Purchase Plan
• Medical coverage
• Vision coverage
• Dental coverage
• 401(k) retirement plan
• Short-term disability insurance
• Long-term disability insurance
• Life insurance
• Paid parental leave
• Various other discounts and perks
• 3 weeks of paid vacation
• 10 or more paid holidays per year
• Paid sick time (in Washington State)
• Company shuttles (from select Seattle locations to Redmond office)

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level