The Dry Etch Manufacturing Engineer develops and implements dry/plasma etch processes—including RIE, IBE, and ashing—for next-generation magnetic recording heads. The role includes designing and conducting wafer experiments, analyzing data, and reporting results; improving process performance, cost, and operational efficiency; investigating process failures and implementing corrective actions; and supporting the transition of new products into production. The engineer maintains process documentation and instructions, works with suppliers and internal manufacturing teams, trains operators and technicians, and partners with equipment, maintenance, process, and product engineering groups to minimize downtime, improve yield, and reduce scrap. This position is based in Milpitas, California. Work is primarily in an office Monday through Friday, with possible schedule changes to meet business or operational needs and travel between buildings. The role may also involve work in a Class 100 ESD-sensitive wafer fabrication facility, where safety and dress standards apply. Facility conditions may include occasional exposure to hazardous chemicals, fumes, vapors, and excessive noise. The role involves standing, walking, fine grasping, bending, twisting, computer and office-equipment use, and occasional pushing, pulling, or lifting up to 10 pounds.
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Job Type
Full-time
Career Level
Mid Level