Dry Etch Manufacturing Engineer

HEADWAY TECHNOLOGIES INC•Milpitas, CA

2d•$120,819 - $177,675•Onsite

About The Position

The Dry Etch Manufacturing Engineer develops and implements new dry/plasma etch processes—including RIE, IBE, and ashing—for next-generation magnetic recording heads. The role designs and conducts wafer experiments, analyzes results, and recommends improvements to process performance, cost, yield, and scrap. It also develops process controls and procedures for transferring new products into production, performs root cause analysis, and maintains process documentation and instructions. The engineer works with suppliers, operators, technicians, equipment and maintenance personnel, and other engineering groups to support production, ensure materials are available, train staff on processes, and minimize equipment downtime. The position is based in Milpitas, California, and works primarily in an office Monday through Friday, with occasional work in a Class 100 ESD-sensitive wafer fabrication facility. The role follows required safety and dress standards and may involve exposure to chemicals, fumes, vapors, and noise. The annual base salary range is $120,819–$177,675, plus a bonus target and benefits.

Requirements

Bachelor’s degree in Materials Science, Physics, or Electrical Engineering, or equivalent relevant experience.
Three years of experience as a Process Engineer in the magnetic recording head, hard disk drive, or semiconductor industry.
Experience working in a wafer fab manufacturing environment.
Experience with Statistical Process Control (SPC).
Proficiency with Microsoft Office applications.
Knowledge of semiconductor or HDD industry principles, practices, and techniques.
Knowledge of wafer fabrication techniques, including process development and integration.
Knowledge of plasma etch principles, practices, and techniques, including RIE, IBE, and ashing.
Knowledge of TEM, SEM, and FIB, and ability to analyze data from these sources to identify failure root causes.
Ability to use Excel, JMP, VBA, or similar software to analyze data, create reports, present findings, and recommend actions.
Ability to create reports and presentations using Microsoft Office applications.
Effective verbal and written communication skills with contractors, consultants, employees, and management at all levels.
Ability to work productively and collaboratively with employees and management at all levels.
Ability to comply with safety policies and procedures.
Organizational and time-management skills.
Problem-solving and troubleshooting skills.
Flexibility and ability to prioritize.

Nice To Haves

Master’s degree preferred.
Experience in plasma etch process development, including RIE, IBE, or ashing, is preferred.

Responsibilities

Develop and implement dry/plasma etch processes, including RIE, IBE, and ashing, for next-generation magnetic recording heads.
Review FIB, SEM, and TEM characterization data to conduct root cause analysis and recommend corrective actions.
Implement process control schemes and methodologies to ensure product manufacturability.
Develop and implement practices that reduce cost and improve operational efficiency.
Develop and implement processes and procedures for transitioning new products into production.
Review, update, and maintain documentation and process instructions.
Work with suppliers and vendors to ensure materials and supplies are available for production.
Instruct operators and technicians on processes and procedures, including changes to existing procedures.
Partner with equipment and maintenance personnel to minimize tool downtime and integrate new tools into production.
Design and conduct experiments, analyze data, and recommend ways to improve performance or reduce cost.
Partner with process, product engineering, and other groups to implement processes that reduce scrap and improve yield.
Respond to inquiries from team members, managers, and other departments.
Follow all required safety policies and procedures.