Director Quality, Reliability & I/O

PsiQuantum•New York, NY

5d•$191,600 - $225,100

About The Position

The Director of Quality, Reliability and I/O will lead the teams and foundry partnerships responsible for quality, reliability, and advanced interconnect technologies across PsiQuantum’s photonic and electronic platforms. The scope includes wafer-level bumping, Optical I/O, electrical I/O, back-end interconnect, and the interface with EIC foundries. This leader will set technical direction, build and develop multidisciplinary teams, and ensure processes and components meet product performance, reliability, manufacturability, and schedule requirements. Working across design, process integration, product, test, and external manufacturing partners, the Director will establish qualification strategies, resolve yield and reliability issues, and mature technology from development through product and system builds.

Requirements

Graduate study in electrical engineering, Materials Science, Applied Physics, or a closely related field.
At least 10 years of relevant experience in semiconductor, photonics, electronics, packaging, quality, or reliability engineering.
Demonstrated experience leading technical teams or organizations, including setting priorities, developing talent, and delivering complex programs.
Experience with semiconductor quality and reliability methods, qualification planning, failure analysis, and corrective action.
Experience with wafer-level bumping and advanced packaging or back-end interconnect technologies.
Experience with Optical I/O and/or high-speed electrical I/O technologies and their integration with photonic or electronic products.
Experience interfacing with EIC foundries or other semiconductor manufacturing partners on technology development, process integration, qualification, and production issues.
Strong understanding of semiconductor manufacturing, process integration, design requirements, and product qualification.
Experience using yield, process-control, metrology, test, and reliability data to drive technical decisions and improvements.
Proven ability to lead cross-functional programs involving design, process, product, test, quality, reliability, and external partners.
Excellent communication and stakeholder-management skills, including the ability to explain technical risks and decisions to engineering teams and senior leadership.
Ability to manage multiple priorities and deliver results in a fast-moving, collaborative environment.

Responsibilities

Lead the Quality and Reliability functions, setting priorities, operating plans, and technical direction to support product and platform development.
Build and manage teams responsible for wafer-level bumping, Optical I/O, electrical I/O, and back-end interconnect technologies.
Lead the EIC foundry interface, coordinating technology qualification, design requirements, and issue resolution with foundry partners.
Manage teams maintaining quality systems, reliability plans, qualification methods, acceptance criteria, and engineering controls for relevant processes and products.
Direct qualification and reliability programs for wafer-level reliability qualification, including test-vehicle strategy, data review, and qualification readiness.
Drive cross-functional investigations into yield, quality, reliability, and manufacturing issues; coordinate corrective and preventive actions with internal teams and external partners.
Ensure design, process, packaging, and test requirements are aligned, including design-for-reliability and manufacturability considerations.
Develop supplier and foundry relationships, guide joint development work, and track partner performance against technical and program objectives.
Use process, inspection, metrology, test, and reliability data to identify risks, improve process capability, and inform technical decisions.
Communicate program status, technical risks, and resource needs to executive leadership and partner organizations.