Director of Semiconductor Technology

Helion•Everett, WA

2d•$325,000 - $375,000•Onsite

About The Position

Helion is hiring a Director of Semiconductor Technology to lead the development of semiconductor devices and packaging for its fusion power systems. The role owns the semiconductor roadmap, from device physics and design through development-scale fabrication, characterization, reliability qualification, and pilot module assembly and test, then into high-volume production with external fabrication partners. The work includes designing devices for Helion’s pulsed-power circuits, integrating gated devices into multi-die modules, and developing packaging that withstands repetitive high-energy pulsing. The Director will build and lead a multidisciplinary team, establish development-scale fabrication and reliability capabilities, make decisions about tooling, processes, and facilities, and manage partnerships with production fabrication facilities and existing device vendors. The role also plans and runs a multi-million-dollar development program, including work supported by external research partnerships, and collaborates across technical and operational disciplines to develop semiconductor capabilities alongside machine architecture.

Requirements

12 or more years of semiconductor experience, including 5 or more years leading technical teams.
Track record of hiring and developing engineers and technical leaders and establishing a culture of high performance and delivery.
Deep expertise in power semiconductor device physics and design, including device modeling and design for reliability.
Hands-on expertise in high-power packaging and module integration, including die attach, interconnect, and thermal management.
Experience taking a custom semiconductor device from concept through fabrication, characterization, qualification, application integration, and high-volume production with external fabricators.
Experience owning a multi-year R&D program with a budget in the tens of millions, from planning and vendor contracting through executive-level reporting.
Ability to set technical direction across disciplines and make build-versus-buy tradeoffs involving performance, reliability, cost, schedule, and manufacturing scale.
Bachelor’s degree in electrical engineering, physics, materials science, or a related field.

Responsibilities

Own Helion’s semiconductor roadmap, define device requirements with technical leadership, make build-versus-buy decisions, and deliver capabilities for successive generations of fusion machines.
Build and lead a multidisciplinary team of semiconductor scientists, device R&D engineers, and technicians.
Establish development-scale device fabrication, characterization, and reliability capabilities, including tooling, process, and facility decisions.
Direct in-house device design, including alternative device topologies optimized for Helion’s pulsed-power circuits.
Drive novel packaging and integration, including multi-die packages for gated devices used in series, thermal management for repetitive operation, and reliability qualification.
Establish and lead partnerships with high-volume fabrication facilities to transfer in-house-developed devices into scaled production, and develop existing device-vendor relationships.
Plan and run a multi-million-dollar development program, including externally funded research partnerships, with appropriate reporting and risk management.
Work with electrical, mechanical, science, operations, and systems leadership to develop semiconductor capabilities and machine architecture together.