Dielectric and Polymer Materials Engineer

Absolics Inc•Covington, GA

22h•$100,000 - $150,000•Onsite

About The Position

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions. You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

Requirements

Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
Fluent in English; proficiency in Korean is a plus.

Nice To Haves

Direct experience with glass core or glass interposer dielectric process integration
Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
Experience with CMP of dielectric films in damascene or hybrid bonding contexts
Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
Track record of material supplier engagement and collaborative efforts for material testing and qualification
Publication record or patent activity in dielectric materials for packaging is a plus

Responsibilities

Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms