CryoCMOS Design Director, Quantum

GlobalFoundries•Austin, TX

1d•$166,500 - $319,000

About The Position

GlobalFoundries is seeking a leader to build and lead its CryoCMOS IC design capability and deliver differentiated integrated circuit solutions for quantum and other advanced applications. The role leads a multidisciplinary team of approximately 10–20 analog, RF, digital, mixed-signal, and physical design engineers, providing technical and people leadership across the complete IC development lifecycle—from architecture and circuit design through verification, tapeout, silicon characterization, and design-to-silicon correlation. The position provides technical direction, organizational leadership, and execution ownership. It works closely with technology development, PDK, compact modeling, test, packaging, design enablement, customers, and ecosystem partners to translate process capabilities and system requirements into robust IC solutions and executable development programs. The role also establishes design processes, reusable IP, methodologies, quality standards, and execution metrics, while recruiting, developing, and coaching engineering talent.

Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field.
At least 10 years of relevant semiconductor IC design experience, including progressively increasing technical leadership responsibilities.
Demonstrated experience successfully leading and managing IC design teams; multidisciplinary teams spanning analog, mixed-signal, RF, digital, and/or physical design are preferred.
Demonstrated experience leading complex IC development through architecture, design, verification, physical implementation, tapeout, silicon bring-up, characterization, and design-to-silicon correlation.
Strong understanding of CMOS IC design, semiconductor devices, design methodologies, physical implementation, verification, PVT variation, parasitic effects, and silicon characterization.
Demonstrated ability to manage multiple complex IC development activities, prioritize engineering resources, mitigate technical and program risks, and deliver against schedule.
Demonstrated ability to recruit, develop, coach, and retain high-performing engineering teams and technical leaders.
Ability to communicate complex technical topics, priorities, risks, and recommendations effectively across engineering teams, customers, management, and senior leadership.
Fluency in written and verbal English.
Willingness to travel up to 10%.

Nice To Haves

Master's degree or PhD in Electrical Engineering, Microelectronics, Computer Engineering, Applied Physics, or a related field.
Experience leading IC design organizations of 10 or more engineers, including multidisciplinary analog, RF, mixed-signal, digital, and/or physical design teams.
Experience with cryoCMOS, quantum-control/readout electronics, low-temperature electronics, or other advanced semiconductor applications.
Deep technical expertise in at least one IC design discipline, such as analog/mixed-signal, RFIC, digital IC, or high-speed circuit design, combined with sufficient breadth to lead multidisciplinary IC development.
Experience working closely with semiconductor technology development, PDK, compact modeling, EDA, test, packaging, and silicon characterization teams.
Experience establishing or scaling an IC design capability, including design methodologies, reusable IP, design flows, technical review processes, and tapeout execution practices.
Experience engaging customers and ecosystem partners to translate system-level requirements into semiconductor technology and IC design solutions.
Project management skills, including the ability to innovate, execute on important solutions, and navigate ambiguity.
Strong written and verbal communication skills.
Strong planning and organizational skills.

Responsibilities

Lead a multidisciplinary CryoCMOS IC design team of approximately 10–20 engineers, setting technical direction, priorities, resource plans, and execution strategy across analog, RF, digital, mixed-signal, and physical design.
Drive end-to-end development of CryoCMOS ICs and reusable design IP, from system and circuit architecture through design, simulation, physical implementation, verification, tapeout, silicon bring-up, and characterization.
Provide technical leadership for complex IC development, including architecture and design reviews, design methodology, performance optimization, design closure, technical risk identification, and resolution of critical design issues.
Develop differentiated IC solutions, reusable IP, design methodologies, and enablement capabilities leveraging GF process technologies for cryogenic, quantum, and other advanced applications.
Partner with PDK, compact modeling, technology development, test, packaging, and design enablement teams to translate process capabilities into robust, manufacturable IC solutions and identify design or modeling gaps.
Establish and continuously improve IC design processes, technical review mechanisms, quality standards, and execution metrics to enable predictable delivery and successful tapeouts.
Build and develop a high-performing engineering organization through recruiting, coaching, technical mentorship, performance management, succession planning, and development of future technical leaders.
Collaborate with internal stakeholders, customers, and ecosystem partners to translate system requirements and technology opportunities into design roadmaps, IC architectures, and executable development programs.
Perform all activities in a safe and responsible manner and support Environmental, Health, Safety & Security requirements and programs.
Work and collaborate on other projects and assignments as needed.