Strategic Student Program: Cross-Domain Manufacturing Systems Engineering Intern (T&I, Spring 2027)

Siemens • Wilsonville, OR

7d • $18 - $50 • Hybrid

About The Position

Siemens Industry Software is recruiting a student intern for its Strategic Student Program. The intern will join the Cross Product Solution Management team, which researches and develops solutions that connect engineering disciplines across product lifecycle management (PLM), robotics, mechatronics, semiconductor manufacturing, electronics, AI, and software engineering. The internship contributes to a “silicon-to-rack” engineering initiative demonstrating integrated EDA, PLM, and AI-enabled workflows across the product development lifecycle.

The intern will work with senior engineers and technical specialists to research semiconductor engineering technologies and workflows, develop prototypes and automation tools, document findings, and help demonstrate an end-to-end engineering digital thread from silicon design through system deployment. Project assignments may provide exposure to semiconductor and IC design, CAE methodologies, advanced packaging, mechanical design integration, PLM, technical documentation, workflow development, and manufacturing concepts.

The position is for students in their first or second semester of senior year or at graduate level, with graduation in 2028 or later. The role is listed as full-time temporary and fixed-term, with a hybrid work mode. Locations include Detroit, Michigan, and Wilsonville, Oregon; remote work may be possible depending on the degree level pursued. The hourly pay range is $18 to $50, with actual compensation dependent on work location, degree type, education, experience, skills, qualifications, and other factors. Interns may contribute to Siemens’ 401(k) program and receive time off under company policies, including paid sick leave and paid volunteer time off.

Requirements

• Currently enrolled as a university senior, master’s student, or Ph.D. candidate; the program seeks students in their first or second semester of senior year or graduate-level study.
• Graduating in 2028 or later.
• Minimum 3.0 GPA.
• Authorized to work in the United States without current or future company sponsorship.
• Pursuing a bachelor’s, master’s, or Ph.D. degree in Mechanical Engineering, Electrical or Electronics Engineering, or a related STEM field.
• Strong analytical and problem-solving skills.
• Excellent verbal and written communication skills.
• Ability to learn quickly and work independently.
• Self-motivated, curious, and adaptable.

Nice To Haves

• Research emphasis or exposure in semiconductor packaging design and implementation.
• Interest in CAE, EDA, PLM, automation, or AI technologies.
• Familiarity with Linux or scripting environments.
• Previous internship, co-op, or project experience.

Responsibilities

• Research and evaluate emerging semiconductor engineering technologies, including 3D IC, and related workflows.
• Develop software prototypes, automation tools, and proof-of-concept solutions.
• Work with semiconductor, PCB, and system-level design, validation, and implementation concepts.
• Document technical findings through white papers, tutorials, and technical guides.
• Investigate AI-assisted engineering and documentation workflows.
• Learn and use industry-leading EDA and PLM tools.
• Help define and demonstrate an end-to-end engineering digital thread from silicon design through system deployment.
• Contribute to research, development, and documentation of a reference silicon-to-rack product development workflow connecting CAE, EDA, PLM, and AI technologies across semiconductor design and packaging, system design, mechanical engineering, and lifecycle management.

Benefits

• Paid volunteer time off.
• Employee discounts at top customer sites.
• Networking with global leaders.
• Mentorship from senior engineers.
• Individual career development planning.
• Professional and technical workshops.
• Energetic student community.
• Leadership opportunities.
• Potential for full-time offers after university graduation and program completion.
• Health and wellness benefits.
• Paid sick leave in accordance with company policies.
• Eligibility to contribute to the company 401(k) program.

What This Job Offers

• Job Type: Full-time
• Career Level: Intern