The Chip Lead provides technical leadership for the architecture, design, integration, and execution of complex wireless System-on-Chip (SoC) products, from initial product definition through silicon bring-up and production. This role requires deep technical expertise in SoC architecture, microarchitecture, and design, including processor subsystems, memory architectures, interconnects, clock and reset architectures, low-power design, digital and mixed-signal IP, and wireless connectivity. The Chip Lead is responsible for translating product requirements into a cohesive SoC architecture, driving key technical decisions and design tradeoffs, and ensuring that the chip meets its functional, performance, power, area, and cost objectives. The Chip Lead works hands-on with engineering teams to drive subsystem design, IP integration, verification, physical implementation, and design closure. The role requires the ability to identify and resolve complex technical issues, challenge design assumptions, evaluate architectural alternatives, and make informed engineering decisions across multiple disciplines. As the overall technical owner of the chip, the Chip Lead coordinates engineering execution across global design teams, establishes technical milestones, manages design dependencies and risks, and drives the SoC through tapeout, silicon bring-up, and production readiness.
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Job Type
Full-time
Career Level
Senior