Baseband Hardware/Systems Engineer

Qualcomm•San Diego, CA

6d•$96,000 - $144,000

About The Position

Qualcomm's Central Baseband Hardware Systems organization develops baseband and embedded system reference designs, focusing on the co-design of silicon, package, and PCB interconnect technologies for Qualcomm application processors and power management ASICs. These highly integrated reference designs incorporate Qualcomm’s high-performance SOCs, high speed memories, high resolution displays, power management ICs (PMICs), 5G RF transceiver cards and a host of digital & analog peripherals (audio, USB/OTG, Bluetooth, GPS, MIPI, WLAN and LAN/Ethernet).

Requirements

Board-level hardware design experience involving CPU-based platforms, consumer electronics, mobile devices, AR/VR products, wearables, compute devices, and/or low-power systems.
Digital/baseband and analog circuit design experience.
Experience with signal integrity and power integrity tools and methodologies.
Proficiency with PCB schematic capture and layout tools such as Xpedition and/or Allegro.
Strong problem-solving, communication, and cross-functional collaboration skills.
Bachelor's degree in Engineering or related field.

Nice To Haves

Mobile handset or battery-powered consumer electronics design experience.
Smart glasses, AR glasses, VR headset, or wearable hardware design experience.
Laptop, tablet, or computer hardware design experience.
Experience with ARM or x86 platforms operating above 1 GHz and utilizing LPDDRx memory interfaces.
Experience with complex multi-module, high-speed hardware designs.
Familiarity with low-power design techniques.

Responsibilities

Define system and reference design requirements in collaboration with cross-functional and geographically distributed teams.
Develop and document platform architectures for mobile, AR/VR, wearable, laptop, tablet, and compute products based on Qualcomm SoCs, ASICs, and PMICs.
Design and implement high-speed digital/baseband hardware, including schematic capture, BOM development, PCB/PWB layout support, and stackup definition.
Perform signal integrity and power integrity analysis, simulation, and optimization for high-speed interfaces, memory subsystems, and power delivery networks.
Design and integrate high-speed interfaces including PCIe, USB, Ethernet, SPI, and I2C.
Support electrical and mechanical integration of hardware into consumer product form factors.
Collaborate with silicon, package, systems, CAD, and customer engineering teams to drive successful platform development.
Provide technical leadership and direct engagement with ODM partners throughout reference design development and production.
Conduct design reviews, develop design guidelines, and provide feedback on ODM-manufactured designs.
Apply DFT, DFM, and high-volume manufacturing best practices throughout the design process.
Quickly assimilate into existing projects, interpret technical requirements, and solve complex hardware design challenges.