Auto/Manual Die Attach Operator I (24299)

NEOTECH•Los Angeles, CA

23d•$18 - $20•Onsite

About The Position

Operation of automatic epoxy dispense, screen printing, and microelectronic component placement equipment in a clean-room environment, to manufacture high-reliability microelectronic devices.

Requirements

Perform general physical activities.
Monitor processes, materials and surroundings.
Experience with programming and/or operating any or all of the following machines: Camelot, Asymtek epoxy dispensers, MRSI and Palomar Pick and Place equipment or equivalent.
Minimum 1 year working experience as a manual die attach/sub-attach operator in a microelectronic assembly factory.
Familiar with MIL-PRF-38534 requirements for microelectronics’ assembly.
Ability to work in a class 100,000 (class 8) clean room environment using clean room antistatic gowns, facemasks, hair covers etc.
Ability to work with a 30X microscope throughout the day.
Ability to work in manufacturing area with normal factory noise levels.
Ability to work on a team and be a good team member.
Ability to access documents using a computer
Should not have a problem in using chemical based cleaning systems for cleaning build substrates etc.
Sense of urgency, successful at meeting deadlines.
Mechanical aptitude/dexterity and the ability to lift up to 20 lbs
Fluency in English Language- Reading, written & spoken
High School Diploma /GED or equivalent experience
U.S. Citizenship
Candidates being considered for hire must pass a pre-employment background check and drug test which include screening for illegal drugs and marijuana.
Due to ITAR and / or CUI compliance, this position requires candidates to be a U.S. Citizen.

Responsibilities

Read and interpret assembly instructions, drawings and work instruction processes.
Set up and run epoxy dispensing equipment.
Set up and run pick and place machines.
Some programming required
Ability to handle computers in order to fine tune machine programs.
Written tests for ESD + Manual Die attach and Auto die attach requirements.
Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, scales.
Handle fine pitched micro electronics components such as dies, air-bridge dies, capacitors, resistors, substrates, hybrids. In addition handle epoxy and cut performs for the purpose of assembly of the above mentioned components.
Knowledge of how to open and close die waffle packs and handle air-bridge die gel packs.
Ability to hand apply epoxy and solder on densely populated substrate pads without disturbing epoxy on neighboring pads.
Ability to manually place above mentioned components on substrates without disturbing neighboring wet assemblies.
Ability to perform rework- removing epoxy, die and other components from the substrate and applying fresh epoxy and installing new components using the above mentioned tools, hot plate etc.
Work with sikama reflow equipment and ovens.
Inspect - to the prints and procedures – the epoxy placement, microelectronics component assembly and substrates for defects before starting the assembly and after finishing his/her part of the assembly.
Adhere to all ESD and other handling requirements.
Comply with all in-house training as identified in job specific family and or specific training plan.
Follow company 6S and continuous improvement (kaizen) objectives.
Perform all other duties, as assigned.

Benefits

Comprehensive benefit package including medical, dental and vision coverage; company-paid basic life/AD&D insurance, short-term and long-term disability insurance; voluntary supplemental insurances, flexible spending accounts and employee assistance program (EAP).
Sick Leave, Vacation Time, and company-paid Holidays are also provided as paid time off.
NEOTech also provides a 401(k) Retirement Savings Plan option with a company match.

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