Intern - ATE Process Engineer, PCVD ID1

Micron•Boise, ID
•Onsite

About The Position

Micron Technology is a world leader in memory and storage solutions. Its Boise site is undergoing a $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. The High Volume Manufacturing team supports innovation, operational excellence, and factory performance to deliver memory solutions at scale. As an ID1 High Volume Manufacturing Process Engineer Intern, you will work in a fast-paced fab environment on process optimization, yield improvement, and cost reduction. You will collaborate with equipment engineers, operations leaders, and cross-functional partners, using data-driven and AI-enabled approaches to improve process stability and wafer output.

Requirements

  • Currently pursuing a STEM degree with an expected graduation between May and June 2027.
  • Available to work approximately 20 hours per week onsite in Boise, Idaho, for 6–8 months.
  • Foundational knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE).
  • Experience with one or more programming or data tools, such as Python, Java, MATLAB, Tableau, or Microsoft Excel.
  • Strong problem-solving and analytical skills, including exposure to AI-supported tools or data-driven methodologies.

Nice To Haves

  • Experience in semiconductor manufacturing, process engineering, or sustaining environments.
  • Familiarity with data collection systems, data cleansing, and database querying.
  • Hands-on experience with data analysis, visualization, and interpretation of large datasets.
  • Basic understanding of semiconductor fab processes, equipment, and yield drivers.
  • Strong communication, organization, and time-management skills, with the ability to collaborate in team environments.

Responsibilities

  • Monitor and analyze production data to identify process shifts, yield loss, and defect trends affecting wafer output.
  • Apply SPC, FDC, and structured problem-solving methods such as 8D to improve process capability and tool performance.
  • Partner with equipment and operations teams to resolve excursions, defects, and throughput issues.
  • Implement projects to optimize wafer processing, improve yield, and increase wafer outs.
  • Leverage AI-enabled or AI-assisted analytics tools to improve data analysis, anomaly detection, and decision-making in manufacturing processes.

Benefits

  • Choice of medical, dental, and vision plans.
  • Programs that help protect income in the event of illness or injury.
  • Paid family leave.
  • Paid time off.
  • Paid holidays.
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