The Boeing Company is seeking Associate Mechanical Product Design and Analysis Engineers (Level 2) for its Space Electronics Packaging team in El Segundo, California. The role contributes to end-to-end product lifecycle work, from initial design concepts and prototyping through production, including mechanical printed circuit board design, electronics packaging, and thermal, structural, and vibration analysis. Projects may involve satellite missions, multichip modules, microelectronics, and electronic systems. The position works closely with satellite and multidisciplinary engineering teams and uses an on-site satellite factory to support collaboration and product integration. It works under general direction and is expected to be 100% onsite in El Segundo. The position requires the ability to obtain a U.S. security clearance, with a final U.S. Top Secret/SCI clearance required after starting. U.S. citizenship is required to obtain the clearance. Candidates must also meet U.S. export-control requirements as a U.S. Person. Boeing will not sponsor employment visas. The role is not contingent upon program award and is not classified as safety sensitive. Relocation is available based on candidate eligibility. The listed summary pay range is $98,600–$133,400.
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Job Type
Full-time
Career Level
Entry Level