ASIC II - AMZ25487.3

Amazon • Austin, TX

38d • $141,586 - $184,000

About The Position

Multiple Positions Available:

1. Develop detailed CFD and compact RC models for SoC and Package
thermal analysis
2. Knowledge of hardware and software based thermal / power
management control algorithms
3. Optimize air and liquid cooled thermal solutions under PPA and
system design constraints
4. Simulate and prototype thermal control strategies
5. Validate thermal models through power/thermal measurements on
Hardware
6. Responsible for the design and optimization of hardware for largescale data
center deployment including rack level integration, liquidcooling facility
integration and serviceability
7. Identify, design, test and integrate new thermal-mechanical
technologies for large-scale server deployments to deliver a world
class customer experience.
8. Own thermal-mechanical design from the lowest levels of chip SOC
design to rack assembly and see those systems all the way through
to high volume manufacturing.
9. Domestic or international travel up to 25% to perform role
responsibilities may be required

(40 hours / week, 8:00am-5:00pm, Salary Range $141586 - $184000)

Amazon.com is an Equal Opportunity – Affirmative Action Employer – Minority /
Female / Disability / Veteran / Gender Identity / Sexual Orientation

Basic Qualifications: Master’s degree or foreign equivalent degree in Mechanical
Engineering, Thermal Engineering, or a related discipline and 3 years of
experience in the job offered or a related occupation in mechanical engineering,
thermal engineering or related. In the alternative, employer will accept a
Bachelor’s degree or foreign equivalent degree in Mechanical Engineering,
Thermal Engineering, or a related discipline followed by 5 years of
progressively responsible post-baccalaureate experience in the job offered or a
related occupation in mechanical engineering, thermal engineering or related.
Experience must include:
1) 3 years of experience in Mechanical and Thermal design of both air and liquid
cooled electronic Systems
2) 3 years of experience in thermal and performance measurements and
characterization on SoCs, Servers, and Systems
3) 3 years of experience with SoC thermal/mechanical design methodology, power
modeling and thermal analysis techniques
4) 3 years of experience with programming languages: Python, C++, and working in
Linux environment .

Preferred Qualifications: All applicants must meet all the above listed
requirements.

Amazon is an equal opportunity employer and does not discriminate on the basis
of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our
customers. If you have a disability and need a workplace accommodation or
adjustment during the application and hiring process, including support for the
interview or onboarding process, please visit
https://amazon.jobs/content/en/how-we-hire/accommodations
[https://amazon.jobs/content/en/how-we-hire/accommodations] for more
information. If the country/region you’re applying in isn’t listed, please
contact your Recruiting Partner.

Requirements

• Master’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline and 3 years of experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related.
• In the alternative, employer will accept a Bachelor’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline followed by 5 years of progressively responsible post-baccalaureate experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related.
• 3 years of experience in Mechanical and Thermal design of both air and liquid cooled electronic Systems
• 3 years of experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
• 3 years of experience with SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
• 3 years of experience with programming languages: Python, C++, and working in Linux environment

Responsibilities

• Develop detailed CFD and compact RC models for SoC and Package thermal analysis
• Knowledge of hardware and software based thermal / power management control algorithms
• Optimize air and liquid cooled thermal solutions under PPA and system design constraints
• Simulate and prototype thermal control strategies
• Validate thermal models through power/thermal measurements on Hardware
• Responsible for the design and optimization of hardware for largescale data center deployment including rack level integration, liquidcooling facility integration and serviceability
• Identify, design, test and integrate new thermal-mechanical technologies for large-scale server deployments to deliver a world class customer experience.
• Own thermal-mechanical design from the lowest levels of chip SOC design to rack assembly and see those systems all the way through to high volume manufacturing.
• Domestic or international travel up to 25% to perform role responsibilities may be required

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level