AI Automation Design Packaging Lead

Advanced Micro Devices, Inc•Austin, TX

8d•Hybrid

About The Position

We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

Requirements

Proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows.
Drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows.
Excellent cross-functional collaboration skills to work between Design, EDA, and AI teams.
Good executive presentation skills.
Strong technical leadership to excel in his/her work with minimum supervision.
Strong interest in growing within the technical or management ladder.
Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

Nice To Haves

Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
Proven track record of developing automation using Python, Tcl, SKILL, or C++.
Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
Good leadership and interpersonal skills.

Responsibilities

Drive the development, deployment, and maintenance of AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
Mentoring junior engineers in coding best practices and advanced packaging concepts.