Advanced Packaging Technology Development Process Integration Engineer

Intel Corporation•Rio Rancho, NM

5d•$133,800 - $188,890•Onsite

About The Position

We are a global leader in semiconductor innovation, pushing the boundaries of silicon manufacturing and advanced packaging technology. Our Advanced Packaging Technology and Manufacturing (APTM) organization is at the forefront of next-generation chip solutions, delivering cutting-edge technologies that power the devices of tomorrow. With a culture built on collaboration, engineering excellence, and continuous innovation, we are committed to developing world-class talent and fostering an environment where bold ideas thrive. Our facility in New Mexico, United States serves as a critical hub for technology development and high-volume manufacturing excellence. We are seeking a talented and driven Process Integration Engineer to join our APTM Silicon Manufacturing Technology Development organization in Albuquerque, New Mexico, United States. In this role, you will play a pivotal part in enabling our advanced packaging manufacturing roadmap by developing and delivering upcoming technology nodes. You will serve as a key technical contributor, bridging process modules, device engineering, yield, and reliability teams to ensure that base die solutions are robust, manufacturable, and aligned with our long-term packaging strategy. This is an exciting opportunity to make a meaningful impact at the intersection of process development and high-volume manufacturing.

Requirements

Bachelor's degree in Engineering, Material Science, Physics, or a related specialized field, with 3+ years of relevant experience; or a Master's degree in one of these fields with 2+ years of relevant experience; or PhD in the same fields with no experience.
Process integration, yield analysis, quality management or process development in high-volume manufacturing environments.
Knowledge of semiconductor advanced packaging techniques and flows.

Nice To Haves

3+ years of experience in value engineering and an innovative mindset to identify cost-effective solutions.

Responsibilities

Lead the development and integration of upcoming advanced packaging technology nodes, ensuring alignment with the APTM packaging roadmap and strategic manufacturing objectives
Partner closely with process module teams, device engineering, yield, reliability, and internal and external stakeholders to develop and deliver comprehensive base die solutions
Own and drive closure of defect, yield (shipped and line), reliability, and device entitlement gaps, utilizing data-driven methodologies to identify root causes and implement sustainable corrective actions
Lead specific process development initiatives from concept through qualification, ensuring technical rigor and manufacturability at each stage of development
Actively support Process Readiness Initiative (PRI) enablement and manage transfer checklist progress to ensure processes are robust, documented, and ready for seamless transition to high-volume manufacturing
Identify and implement cost-effective process solutions through innovative thinking and value engineering principles, contributing to both technical performance and business competitiveness
Collaborate with manufacturing teams to ensure successful knowledge transfer, process stability, and continuous improvement post-transfer