Advanced Packaging Process Development Engineer

SkyWater Technology Foundry, Inc.•Kissimmee, FL

4d•$79,440 - $119,160•Onsite

About The Position

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world. Explore what’s possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. SkyWater’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds. Are you bold thinking? Find your place on our team and help us change the world!

Requirements

1-3 years relevant Semiconductor Industry Experience
Proven understanding of assigned Process steps and interrelation to previous and subsequent Process steps in the Semiconductor manufacturing and Advanced Packaging fields.
Experience with application of structured problem-solving methodology.
Positive interpersonal skills, highly energetic and self-motivated.
Demonstrated ability to meet requirements and deliver results.
Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.
Experience Creating and Managing Process steps.
Strong Experience with set up and use of SPC Charts.
Experience with Advanced Process Control Systems (APC).
Engineering BS program in Materials Science, Physics, Electrical or Chemical Engineering or other relevant BS Degree.
US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance.

Nice To Haves

Background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined).

Responsibilities

Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding.
Work with equipment engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions, and eliminate chronic and long-term down events.
Collaborate with continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk.
Management of new tool qualifications to increase fab capability, capacity, lower costs and improve yields.
Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
Participate in cross-functional teams that create efficiencies across all layers of the organization.
Performing other duties as assigned.