Advanced Packaging Lithography Development Manager

Intel CorporationHillsboro, OR
$155,520 - $298,440Onsite

About The Position

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead our lithography development for next-generation packaging solutions. This role will drive the development and implementation of lithography equipment and processes critical to Intel's industry-leading advanced packaging portfolio, focused on Foveros Direct technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in patterning flow definition and process development. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.

Requirements

  • Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
  • 6+ years of relevant experience with a master's degree, 5+ years or experience with a PhD degree.
  • Equipment Mastery: Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment
  • Process Development: Extensive experience in lithography process optimization, yield enhancement, and/or manufacturing readiness
  • Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.

Nice To Haves

  • Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
  • Experience with vendor relations, including material quality assessments and performance management.
  • Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies

Responsibilities

  • Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
  • Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
  • Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
  • Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
  • Drive lithography module and segment related yield improvement initiatives and defect reduction programs
  • Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing

Benefits

  • competitive pay
  • stock bonuses
  • health
  • retirement
  • vacation
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