Advanced Packaging Singulation Engineer

Intel CorporationRio Rancho, NM
$120,860 - $170,630Onsite

About The Position

Intel Corporation is a global leader in technology innovation, dedicated to creating world-changing technology that enriches the lives of every person on earth. With a commitment to advancing computing power and connectivity, Intel drives innovation across a diverse range of industries, including computing, data centers, artificial intelligence, and more. Our collaborative culture fosters creativity and growth, empowering employees to make a meaningful impact in a dynamic and fast-paced environment. We are seeking a Module Engineer to join our team responsible for driving the advancement of semiconductor manufacturing technologies. This role offers an exciting opportunity to work at the forefront of high-volume manufacturing, playing a pivotal role in enabling rapid device miniaturization and the mass production of integrated circuits. You will own critical equipment and processes, ensuring they meet Intel's stringent safety, quality, and efficiency standards while contributing to sustained technology leadership. Through collaboration with global teams and equipment suppliers, you will directly impact Intel's manufacturing excellence, yield improvement, and technological innovation. Note: This role requires regular onsite presence to fulfill essential job responsibilities. This position is not eligible for Intel immigration sponsorship.

Requirements

  • Bachelor's degree in a STEM or related field, or equivalent practical experience per business needs.
  • 4+ years of experience with a Bachelor's degree, 3+ years with a Master's degree, or no experience required with a PhD.
  • Semiconductor metrology, process characterization, and process improvement.
  • Experience in developing and maintaining manufacturing process controls and implementing changes.
  • Knowledge in Design of Experiments (DOE) principles and excursion management.
  • Technical expertise in semiconductor singulation processing.
  • Effective written and verbal communication skills and collaboration skills to work effectively across diverse teams and regions.

Nice To Haves

  • Experience in a semiconductor manufacturing environment, particularly in process analytical metrology or process development.
  • Familiarity with statistics and experimental design methodologies, with the ability to apply these to tool matching, tool qualification, and process optimization.
  • Understanding of semiconductor process flows, logic or memory, and their associated metrology assessments.
  • Demonstrated project management experience, including leading task forces to resolve complex problems.

Responsibilities

  • Operate and optimize high-volume manufacturing equipment and processes to ensure control over critical dimensions and defectivity.
  • Conduct tests and measurements to evaluate equipment and process performance, recommending and implementing modifications to enhance productivity and quality.
  • Lead the execution of maintenance and repair activities for assigned equipment and modules.
  • Drive continuous improvement initiatives to optimize safety, productivity, cost, and yield, collaborating with internal teams and external suppliers.
  • Develop and implement excursion prevention systems to detect and address discrepant material or activities associated with the equipment and process.
  • Support the transfer of technology to manufacturing sites worldwide through training, audits, and documentation to ensure consistent processing across locations.
  • Own the installation, conversion, and qualification of equipment during factory ramps, ensuring compliance with safety and quality standards.
  • Leverage data-driven techniques, such as Design of Experiments (DOE), to characterize, control, and improve manufacturing processes.

Benefits

  • competitive pay
  • stock bonuses
  • health
  • retirement
  • vacation
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