Advanced Packaging Metro Module Engineer

Intel Corporation•Rio Rancho, NM

1d•$120,860 - $170,630•Onsite

About The Position

Intel Corporation is a global leader in technology innovation, dedicated to creating world-changing technology that enriches the lives of every person on earth. With a commitment to advancing computing power and connectivity, Intel drives innovation across a diverse range of industries, including computing, data centers, artificial intelligence, and more. Our collaborative culture fosters creativity and growth, empowering employees to make a meaningful impact in a dynamic and fast-paced environment. This position provides you with an exciting opportunity to support the development and ramp-up of high-volume manufacturing processes supporting Intel's next generation of advanced packaging technologies such as FOVEROS-S and EMIB. Join us as a Module Engineer and become a vital part of driving innovation and excellence in semiconductor manufacturing. In this role, you will own and optimize high-volume manufacturing equipment and processes that enable groundbreaking advancements in device miniaturization and integration. Your work will directly impact the quality, efficiency, and output of our production lines while playing a key role in advancing our next-generation technology. As a Module Engineer, you will collaborate across global teams, lead technology transfers, and ensure the consistent delivery of premium products that shape the future of technology. Note: This role requires regular onsite presence to fulfill essential job responsibilities. This position is not eligible for Intel immigration sponsorship.

Requirements

Bachelor's or BS degree in a STEM-related field or equivalent education.
A minimum of 4 years of experience with a Bachelor's degree, 3 years with a Master's degree, or no experience with a PhD.
Experience in equipment monitoring, process characterization, manufacturing process improvement, and semiconductor equipment.
Experience in manufacturing process change and optical characterization.

Nice To Haves

Understanding and hands-on experience with metrology fundamentals, tool matching / calibration and development.
Experience in process analytical metrology, packaging processes, and process development.
Experience in experimental design, and their applications to tool matching, qualification, and process optimization.
Familiarity with semiconductor process flows, particularly advanced packaging, and metrology assessment based on process requirements.
Experience in project management and leading task forces from problem identification to resolution.
Experience with equipment automation development and collaborating with equipment suppliers.

Responsibilities

Oversee critical high-volume manufacturing equipment and processes to support the production of advanced integrated circuits.
Conduct tests and measurements to maintain control of critical dimensions and minimize defectivity within the production line.
Implement equipment modifications to enhance production efficiency, optimize manufacturing techniques, and meet safety, quality, and cost objectives.
Manage maintenance, repairs, and upgrades for equipment and associated module components to ensure consistent operational performance.
Drive continuous improvement initiatives focused on key performance indicators, including safety, quality, cost efficiency, yield, and defect reduction.
Collaborate with equipment suppliers to resolve technical challenges and implement innovative solutions.
Lead efforts to install, convert, and qualify equipment during factory ramps, ensuring tools are installed safely, on schedule, and meet quality and matching criteria.
Develop and refine systems for excursion prevention and discrepant material detection to maintain the reliability of equipment and processes.
Facilitate technology transfer to global manufacturing sites through training, audits, and support for installation and qualification processes.