Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

2d•$133,800 - $255,200•Onsite

About The Position

Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing. This role requires regular onsite presence to fulfill essential job responsibilities.

Requirements

PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics.
3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
3+ years of experience with Finite Element Analysis tools
3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.

Nice To Haves

Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
Experience with designing, planning and executing experiments, along with interpretation of results.
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Programming/script development with artificial intelligence and machine learning concepts.
Previous related work experience in a semiconductor foundry preferred.
Demonstrated ability to work seamlessly between experiments and simulations.

Responsibilities

Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
Drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.