Packaging module development engineer
About The Position
Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, addressing quality, cost, yield, and productivity requirements. Collaborate with cross-functional teams to tackle complex challenges, push boundaries, and innovate within a dynamic, fast-paced environment. The scope of this role include: - Process equipment design, install, and qualification - Technology pathfinding and development of multi metal plating module focusing on surface prep processes, electroless and electrolytic plating. - The engineer will join / become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry. Other responsibilities include but are not limited to: - Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies - Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions - Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity - Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development. The ideal candidate should exhibit the following behavioral traits: - Proven technical leadership skills: Self initiative, leadership, action-oriented by influencing, written and verbal communication skills with the ability to work independently. - Demonstrated ability to successfully participate in a highly matrix environment managing resources and timelines, as well as proven stakeholder management. - Flexibility in changing priorities and responsibilities to support business needs. - Work with ambiguity in a fast paced, constantly changing product roadmap environment.
Requirements
- Candidate must possess a Bachelor’s degree in in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management; or related engineering degree plus 2+ years of experience.
- Master's degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management; or related engineering degree.
- Packaging module development experience
- Experience in process equipment design, install, and qualification
- Experience defining and establishing equipment configurations, process specifications, and integrated process flow for new process technologies
Nice To Haves
- Plating chemistry and Electrochemistry fundamental knowledge are a plus.
- PhD degree in in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, or related engineering degree.
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
Responsibilities
- Process equipment design, install, and qualification
- Technology pathfinding and development of multi metal plating module focusing on surface prep processes, electroless and electrolytic plating.
- Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
- Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.
Benefits
- competitive pay
- stock bonuses
- health
- retirement
- vacation
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
