Microelectronics Advanced Packaging Engineer

Booz Allen Hamilton•Beavercreek, OH

3d•$61,900 - $141,000•Remote

About The Position

Apply engineering physics, engineering mathematics, and materials science principles to support the design, analysis, manufacture or maintenance of mechanical systems. Apply specific functional knowledge and working and general industry knowledge. Develop or contribute to solutions to a variety of problems of moderate scope and complexity. Work independently with some guidance and review or guide activities of junior employees.

Requirements

2+ years of experience in dynamic manufacturing and R&D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
Experience in eCAD and mCAD software
Experience with packaging, PCB fabrication, cleanroom processing, or SMT assembly
Experience developing packaging solutions that optimize Size Weight and Power (SWaP) and prototyping designs in a high-mix, low-volume R&D environment
Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
Experience with the complete packaging assembly processes from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems
Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
Ability to obtain a Secret clearance
Bachelor's degree in an Engineering field

Nice To Haves

5+ years of experience with advanced packaging technology innovation and prototyping
Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs
Knowledge of trends related to current technology, including trends related to future technologies, design, or prototyping for DoD systems
Secret clearance
Master's degree in an Engineering field

Responsibilities

Support the design, analysis, manufacture or maintenance of mechanical systems.
Develop or contribute to solutions to a variety of problems of moderate scope and complexity.
Work independently with some guidance and review or guide activities of junior employees.
Evaluate new packaging materials, processes, and architectures to align to state-of-the-art.
Develop packaging solutions that optimize Size Weight and Power (SWaP) and prototyping designs in a high-mix, low-volume R&D environment.
Operate and maintain complex equipment in microelectronics rapid prototyping laboratories.
Manage the complete packaging assembly processes from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems.