Advanced Packaging Principal Integration Technologist

Merck•Tempe, AZ

23h•Hybrid

About The Position

In this role you will be instrumental in developing our High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy and program development. By connecting across key business unit partners and leveraging EMD Electronics core competencies, the candidate will drive business and product development from idea to proof of concept for transfer to high volume manufacturing. The ideal candidate will combine a deep equipment, process and integration knowledge of High Performance Packaging technologies (including Wafer Level Packaging, Hybrid Bonding, Fusion bonding and adjacent technologies) with a vast ecosystem network (both equipment suppliers and IDM/Foundry/Memory customers). The perferred location for this role is Tempe, AZ. Other US locations may be considered.

Requirements

MSc or higher (Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields)
10+ Years 300mm Process/ Equipment R&D hands on experience
Advanced Packaging (300mm) Equipment Tool owner
Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development
Developing integration and process flows
7+ years of collaborative external business developments SOW (Scope of Work)/ POC (Proof of Concept)/DOE’s on equip/material definition

Nice To Haves

5+ years experience of Adv Pkg Consortia engagements (IMEC, Fraunhofer, CEA Leti, etc) including engagement model definition/ SOW development/ POC execution
Demonstrated ability to work in highly ambiguous environments
Demonstrated ability to work across matrixed organizations and deliver results
Demonstrated ability to influence up to garner resources
Entrepreneurial mindset
Ability to condense complicated material down to key actionable items
Ability to enroll resources to deliver success
Demonstrated knowledge of customer/supplier interactions and how best to ‘mine’ the ‘why’s & how’s’ from those conversations
Self-starter, ability to operate with little direction

Responsibilities

Through technical expertise, identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps
Through industry/ecosystem connections continue to acquire in-depth strategic knowledge of customer and OEM roadmaps
Transfer knowledge/educate peers (both laterally and up) on High Performance Packaging (Advanced Packaging) roadmaps
Leverage industry knowledge to identify process/equipment/integration challenges
Work across BU’s and CTO office to identify material solutions/developments to solve industry challenges
Leverage industry network and connections to engage the ecosystem on collaborative development opportunities
Leverage deep technical knowledge to ensure development programs are identifying and meeting industry standard datasets
Ensure development programs are leveraging industry expertise to deliver relevant datasets in the timeliest manner