Principal Packaging Engineer

Delos Data•Palo Alto, CA

11d•Hybrid

About The Position

We are a stealth-mode startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. We are backed by top-tier VC firms and notable angel investors. The company is led by experienced builders and operators who have founded companies, taken them to scale, and exited successfully. We work with a strong sense of unity and shared responsibility, and we expect trust, integrity, and respect in how we collaborate and make decisions. We hold ourselves accountable to one another and to the quality of the work we deliver. Headquartered in Silicon Valley, we operate across a mix of remote and on-site locations in the U.S. and Canada. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.

Requirements

B.S./M.S. in Electrical Engineering or related field.
Experience with multi-die package design and UCIe (AP/SP) integration.
Understanding of substrate materials, stack-ups, and mechanical constraints.
Familiarity with SI/PI concepts to collaborate effectively with electrical teams.
Experience managing packaging subcontractors.
Experience interfacing with TSMC/OSAT for bumping and packaging options.

Nice To Haves

Knowledge of package modeling tools (HFSS, Sigrity, or similar) is a plus.

Responsibilities

Select and design optimal multi-die package types (MCM, 2.5D, 3D, fan-out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
Define substrate stack-ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
Perform high-speed signal escaping, routing and power distribution network design.
Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system-level needs.
Evaluate emerging packaging technologies and drive adoption for next-generation products.
Support package-level bring-up, failure analysis, debug and qualification.