GlobalFoundries (GF) seeks a hands-on Assembly Integration Design Engineer that will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design, with a focus on product and module performance, reliability, packaging design rules, materials selection criteria, and definition of electrical, photonic and thermal requirements for chiplet and product modules.
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Job Type
Full-time
Career Level
Principal