GlobalFoundries (GF) seeks a hands-on Assembly Process Integration Engineer that will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on tool-process interactions for each step in a SiPh Flip Chip assembly, with focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal stress plan for chiplet and product module reliability qualifications.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Ph.D. or professional degree