Advanced Packaging Metrology Engineering Manager

Intel Corporation•Hillsboro, OR

5d•$155,520 - $255,200•Onsite

About The Position

Intel Corporation is a global technology leader at the forefront of semiconductor innovation, dedicated to creating world-changing technology that improves the lives of every person on the planet. Intel's Wafer-Level Assembly Technology Development (WATD) group is a dynamic, forward-thinking organization focused on developing next-generation packaging technologies. With a culture built on collaboration, inclusion, and relentless innovation, Intel offers an environment where your work truly matters — and where the future of technology is being written every day. We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long-term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration.

Requirements

Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master's degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
Relevant experience can be any of the following: Semiconductor wafer or assembly process, equipment, or materials development.
Process development methodology, project management, and schedule-based execution.

Nice To Haves

4+ years of experience in: Metrology area
Managerial position
Wafer-level assembly or wafer-level packaging research and development.
Technical leadership in process development for semiconductor manufacturing.
Hybrid bonded interconnects (HBI), redistribution layer (RDL) packaging, and ultra-fine pitch solder connections.
Lead programs from strategy formation through high-volume production.

Responsibilities

Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
Partner with cross-functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
Execute long-term strategies for module engineering to support future technology needs and market demands.
Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.